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Picosun ALD Fills the Gap in MEMS Devices

Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer expands its central role in the field of European semiconductor manufacturing by taking part in a yet new international R&D project, Lab4MEMS.

Jan 28th, 2013

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Arkema Exhibits its Product Line Dedicated to Nanomaterials at Tokyo Nanotech Tradeshow

This tradeshow will enable Arkema to showcase three innovations developed from its know-how in the nanostructuring of materials: the use at very low rates (around 100 ppm) of Graphistrength in thermoplastic matrices in order to enhance their mechanical performance, the new nanostructured Altuglas ShieldUp PMMA sheet, particularly resistant to impact, and Apolhya Solar, a transparent thermoplastic, also nanostructured, designed for the encapsulation of new generation photovoltaic modules.

Jan 26th, 2013

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Imec Teams With Cadence to Present Automated Design-for-Test (DFT) Solution for 3D Memory-on-Logic

At the European 3D TSV Summit in Grenoble, France on January 22-23, 2013, imec, a world-leading nano-electronics research institute, today announced that together with Cadence Design Systems they have developed, implemented and validated an automated 3D Design-for-Test (DFT) solution to test logic-memory interconnects in DRAM-on-logic stacks. The solution, based on Cadence Encounter Test technology, was verified on an industrial test chip containing a logic die and a JEDEC-compliant Wide-I/O Mobile DRAM.

Jan 22nd, 2013

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Dolomite Introduces Next Generation of Microfluidic Connectors and Interfaces

Dolomite, a world leader in microfluidic design and manufacture, has introduced Multiflux-2, a new range of microfluidic connectors and interfaces offering unparalleled high density connection with 1.5 mm pitch between tubing lines for fast, reliable and precisely aligned connections between microfluidic chips, pumps, sensors, valves and other fluidic modules without disruptions to the fluid flow.

Jan 16th, 2013

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