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Focus Metals and Grafoid Execute a USD$500,000 Loan Arrangement

Focus Metals Inc. announces today that it has completed a loan of USD$500,000 to Grafoid Inc., a private corporation in which Focus owns a 40% interest, in connection with Grafoid's business initiative for the transformation of graphite into graphene on a commercial scale, using primarily raw unprocessed graphite ore from the Corporation's Lac Knife project.

Posted: Mar 19th, 2012

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SUSS MicroTec launches RCD8: The new Resist Coat and Develop Platform

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the RCD8, a new manual Resist Coat and Develop Platform for substrates. The new platform offers a high application variety coupled with low investment costs as well as an easy transfer of processes from the RCD8 manual platform to a SUSS MicroTec production tool.

Posted: Mar 19th, 2012

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QD Vision Awarded $1.38 Million Department of Defense Contract

QD Vision, Inc. today announced it recently was awarded a $1.38 million contract with the Department of Defense for specialized devices based on electroluminescent quantum dots. The 12-month program will result in the development of prototype devices that can be tested under real-world conditions, and that will ultimately be employed by U.S. forces.

Posted: Mar 13th, 2012

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Crocus and Kintech Sign Agreement to Perform Nanotechnology R+D in Russia

Crocus Technology, a leading developer of magnetically enhanced semiconductors, today announced that it has signed a research and development agreement with Kintech Lab, a leading research company in Russia, specializing in the development of advanced methodologies and multi-scale software tools for modeling complex electronics and other physical phenomena.

Posted: Mar 13th, 2012

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Riber and imec Extend Successful Collaboration on Next-generation III-V logic CMOS

Riber, a leading supplier of Molecular Beam Epitaxy (MBE) equipment and services to the compound semiconductor industry, today signed an agreement with imec to further collaborate on epitaxy process technologies for next-generation III-V CMOS devices. The agreement follows a successful collaboration in the field of advanced channel materials for high-performance CMOS scaling, germanium and compound semiconductor (III-V) materials.

Posted: Mar 13th, 2012

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