Researchers at the University of Texas at Austin, USA, have demonstrated high quality wafer-scale deposition of graphene on evaporated copper films for the first time, using their recently acquired cold-wall vertical BM (Black Magic) Pro reactor from AIXTRON.
In a move that extends its market reach and broadens its product portfolio, Advanced Micro-Fabrication Equipment Inc. unveiled the Primo TSV200E - a compact, ultra high-productivity etch tool for 200mm wafer-level packaging, MEMS and 3DIC applications.
3M is investing in research and manufacturing of novel Silicon based 3M anode materials. The technology enables advanced batteries for reliable power that is required to keep up with the global increase of mobile societies and electric vehicles.
QD Vision, Inc. today announced it recently was awarded a $1.38 million contract with the Department of Defense for specialized devices based on electroluminescent quantum dots. The 12-month program will result in the development of prototype devices that can be tested under real-world conditions, and that will ultimately be employed by U.S. forces.
Crocus Technology, a leading developer of magnetically enhanced semiconductors, today announced that it has signed a research and development agreement with Kintech Lab, a leading research company in Russia, specializing in the development of advanced methodologies and multi-scale software tools for modeling complex electronics and other physical phenomena.
Riber, a leading supplier of Molecular Beam Epitaxy (MBE) equipment and services to the compound semiconductor industry, today signed an agreement with imec to further collaborate on epitaxy process technologies for next-generation III-V CMOS devices. The agreement follows a successful collaboration in the field of advanced channel materials for high-performance CMOS scaling, germanium and compound semiconductor (III-V) materials.
At Pittcon 2012, Bruker Corporation today announced several new product introductions for the research, industrial and applied markets, designed to deliver confident analyses with increased sensitivity, specificity and productivity, and to push the boundaries of advanced molecular and materials research applications.
Anasys Instruments, the company that pioneered nanoscale thermal analysis and nanoscale IR spectroscopy using an AFM, is pleased to announce further capabilities for their nanoIR nanoscale infrared spectroscopy system.
Thin Film Electronics ASA has announced receipt of its first engineering order for Thinfilm Passive Array Memory, a non-volatile rewriteable fully-printed memory suitable for a number of applications, including use in secure documents and value cards.
bubbles + beyond, a technology company focusing on customized intelligent fluids, and Fraunhofer Center Nanoelectronic Technologies (CNT), Dresden, today announced their collaboration to jointly develop novel cleaning solutions for the microelectronics industry.
An innovative configuration of the proven AURIGA CrossBeam (FIB-SEM) workstation combines a pulsed micro-focus laser for fast ablation of material with proven FIB-SEM technology. New applications and an awesome improved workflow for numerous tasks.