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New metrology for tuning the etch rate uniformity in plasma etch processes

Imec and KLA Tencor have established a metrology method for optimizing the etch rate uniformity (ERU) in a transformer coupled plasma (TCP) reactor. The proposed metrology method makes use of PVx2 sensor wafers. For ion-assisted etch processes, the use of this PVx2-based method for ERU tuning results in lot-turn time savings of up to 80% compared to conventional etch rate uniformity tests.

Posted: Aug 19th, 2010

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New ISO methodology demystifies nanomaterials

ISO has published a new technical report, ISO/TR 11360:2010, Nanotechnologies - Methodology for the classification and categorization of nanomaterials, offering a comprehensive, globally harmonized methodology for classifying nanomaterials.

Posted: Aug 18th, 2010

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Extreme darkness: Carbon nanotube forest covers ultra-dark detector

Harnessing darkness for practical use, researchers at the National Institute of Standards and Technology (NIST) have developed a laser power detector coated with the world's darkest material - a forest of carbon nanotubes that reflects almost no light across the visible and part of the infrared spectrum.

Posted: Aug 18th, 2010

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Multifunctional nanoparticle enables new type of biological imaging

Spotting a single cancerous cell that has broken free from a tumor and is traveling through the bloodstream to colonize a new organ might seem like finding a needle in a haystack. But a new imaging technique from the University of Washington is a first step toward making this possible.

Posted: Aug 17th, 2010

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