EV Group Introduces Full-field UV Nanoimprint Lithography System For Photonics, LED And BioMEMS Production
(Nanowerk News) EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®720 automated UV nanoimprint lithography (UV-NIL) system. Providing full-field imprint lithography with an integrated soft stamp/template fabrication capability, the EVG720 system enables throughputs of more than 60 wafers per hour with the lowest cost of ownership (CoO). Capable of printing nanostructures as small as 40 nm in diameter over a large area in volume production, the EVG720 system is ideally suited for use in manufacturing optics, photonics, light emitting diodes (LEDs), microfluidics and other bioMEMS devices, as well as advanced data storage devices. Several systems have already been installed, evaluated and accepted at customer sites.
The EVG®720 automated UV-NIL system provides full-field imprint lithography with an integrated soft stamp/template fabrication capability. Enabling throughputs of more than 60 wph with the lowest CoO, it can print nanostructures as small as 40 nm over a large area in volume production. It is ideally suited for manufacturing optics, photonics, LEDs, microfluidics and other bioMEMS devices, as well as advanced data storage devices.
The EVG720 UV-NIL system—EVG's most advanced dedicated NIL system—utilizes a next-generation UV-NIL process designed specifically to address the needs of high-volume manufacturing (HVM). It provides an unmatched combination of high throughput, ease of use and high resolution—enabling volume manufacturing of nanoscale structures at the lowest CoO. EVG's UV-NIL solutions, including the EVG720 system, are designed to work with a wide variety of resist materials. This open materials platform approach provides customers with a high degree of flexibility and process customization.
In addition, the EVG720 has an integrated stamp replication capability, which minimizes tool footprint and avoids increased capital equipment costs associated with stand-alone replication systems. EVG's soft working stamps have optimized releasing properties that extend the life of the stamp and enable ideal imprint results on both flat and rough substrates. Traditional stamps wear down quickly or require additional surface treatment after each imprint and result in increased defectivity on the substrate that leads to yield loss, as well as increased costs from continuous replacement.
"EV Group continues to extend its leadership in low-cost, high-throughput and reliable NIL solutions with our new EVG720 platform, which is built on nearly 20 years of experience with more than 100 UV-based imprint lithography systems in the field," stated Gerald Kreindl, business development manager at EV Group. "We recognize that a one-size-fits-all approach to NIL can't address every customer's unique manufacturing requirements, which is why EV Group has created a complete NIL solutions portfolio that encompasses all widely accepted imprint techniques—UV-NIL, hot embossing, micro contact printing, step-and-repeat, full-field, and roll-to-roll imprint. In addition, we are continuously working to improve the imprint lithography infrastructure by collaborating with companies and research organizations throughout the imprint lithography supply chain."
Media and analysts interested in learning more about EVG's latest developments in nanoimprint lithography and other processing solutions are invited to visit the company's booth #4B-207 in the Makuhari Messe International Convention Complex in Chiba, Japan at the SEMICON Japan show December 4-6 as well as attend the company's presentations during the show's technical program. EVG will present "EVG's HVM solution updates for automotive and smart phone applications," during the Exhibitor Seminar on Wednesday, December 4 from 2:30 – 3:20 p.m. at the International Conference Halls, Room 103. In addition, Masaya Kawano, head of technology Japan / applications engineer for the Technology Division of EV Group Japan, will present "Latest wafer bonders which drive 3D-IC technology" at the Proposals to the Assembly Technologies to Drive 3D-IC session on Friday, December 6 from 1:45 – 2:00 p.m. at the TechSTAGE West, Hall 1.
About EV Group
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors and power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.