Showing videos 1 - 5 of 5 in category Nanomanufacturing, Self-assembly:
| IBM self assembly technology creates airgap microprocessors |
| Source: YouTube |
 | | IBM is applying a breakthrough self-assembling nanotechnology to conventional chip manufacturing, borrowing a process from nature to build the next generation computer chips. The natural pattern-creating process that forms seashells, snowflakes, and enamel on teeth has been harnessed by IBM to form trillions of holes that are used to create insulating vacuums around the miles of nano-scale wires packed next to each other inside computer chips. |
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| Nanomanufacturing: top-down and bottom-up |
| Source: MIT (Mechanosynthesis Group) |
 | | This is a lecture from the Nanomanufacturing course at the University of Michigan, taught by Prof. John Hart. For more information, see http://www.mechanosynthesis.com. |
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| Self Assembling Biomedical Nanoliter Containers |
| Source: The Johns Hopkins University |
 | | The Gracias Lab at Johns Hopkins has developed a relatively easy, precise, and cost-effective process by which the 2D templates of semi-tethered "faces" can self-assemble into controlled 3D structures by utilizing the natural phenomena of surface tension. This video highlights the development, manufacturing process, and proposed functions (cell encapsulation devices and controlled drug delivery carriers) of our self-assembling nanoliter containers. |
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| Self-Assembly of Lithographically Patterned 3D Micro/Nanostructures |
| Source: The Johns Hopkins University |
 | | On the nanoscale, it is extremely difficult and expensive to fabricate analogs of macroscale engineering, such as grippers. Drawing inspiration from biological fabrication in nature, engineers are seeking to self-assemble structures from the bottom up. The Gracias Lab at The Johns Hopkins University has developed a relatively easy, precise, and cost-effective process by which the 2D templates of semi-tethered "faces" can self-assemble into controlled 3D structures by utilizing the natural phenomena of surface tension as well as thin-film stress. |
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