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Posted: April 22, 2009
SUSS MicroTec Receives Multiple Orders from Nemotek Technologie for Wafer-Level Camera Production
(Nanowerk News) Nemotek Technologie, a manufacturer of customized wafer-level cameras for portable applications, has selected multiple lithography systems from SUSS MicroTec, a supplier of innovative solutions for the 3D Integration, Advanced Packaging, MEMS and Nanotechnology markets.
The deal includes a 200mm production mask aligner, coat, bake and develop systems. The systems have been selected for their image sensor wafer-level packaging (WLP) and wafer-level optics (WLO) services and were successfully installed at Nemotek’s facility in Rabat Technopolis Park, Morocco.
SUSS MicroTec provides dedicated equipment for the CMOS image sensor market, which is mainly driven by camera phones. Its packaging revenue is expected to grow more than 150% within the next three years, according to market analyst Yole Developpement.
"We truly believe that wafer-level camera solutions are the technologies of the near future,” said Jacky Perdrigeat, CEO of Nemotek Technologie. “Therefore we’re looking to partner with companies that can deliver innovative manufacturing approaches and support to help us realize our goals of productivity, cost reduction and are able to integrate the future technology trend of this industry. SUSS MicroTec’s spin coaters and mask aligner technology proved to meet our stringent requirements – offering high-quality processing results and an excellent cost-of-ownership.”
Lithography systems from SUSS MicroTec are becoming critically important for applications like 3D image sensor packaging. The highly precise alignment capability coupled with specificly designed exposure optics make mask aligners of SUSS MicroTec the tool of choice for thick-resist applications. SUSS MicroTec coat and develop solutions include a novel dispense system, optimized for a wide range of different materials and viscosities in particular solder mask resist. The SUSS lithography technology guarantees most effective patterning for WLP and 3D Integration applications.