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Posted: August 3, 2009
Nanometrics Receives Multiple System Order for Caliper Mosaic Overlay Metrology Systems
(Nanowerk News) Nanometrics Incorporated, a leading supplier of advanced process control metrology systems used primarily in the manufacturing and packaging of semiconductors, solar photovoltaics and high-brightness LEDs, today announced a multiple system order for its Caliper Mosaic overlay metrology system. The systems will be used in production running in conjunction with the Blossom overlay target technology and are expected to be delivered and qualified in the third quarter of 2009.
The Caliper Mosaic systems were ordered as a follow on to an initial system purchased in 2008 from a leading DRAM manufacturer for high volume lithography process control. The customer will also purchase licenses for the Blossom overlay target technology.
“The Blossom overlay mark, when used in conjunction with our Caliper Mosaic systems enables customers to extend their known metrology technologies while continuing to leverage improvements in precision and throughput,” commented Nigel Smith, Director of Overlay Product Technology at Nanometrics. “The Blossom technology is gaining traction as an alternative to established target schemes as it enables our customers to measure up to 28 layers at one time. This simultaneous multi-layer measurement capability is especially beneficial in double patterning processes, offering the best possible precision for advanced lithography process control of critical layers, while substantially reducing total target real-estate requirements.”
Nanometrics is a leader in the design, manufacture and marketing of high-performance process control metrology systems used primarily in the manufacturing of semiconductors, solar photovoltaics and high-brightness LEDs, as well as by customers in the silicon wafer and data storage industries. Nanometrics standalone and integrated metrology systems measure various thin film properties, critical dimensions, overlay control, topography, and optical, electrical and material properties, including the structural composition of silicon, compound semiconductor and photovoltaic devices, during various steps of the manufacturing process, from front end of line substrate manufacturing through die preparation for advanced packaging. These systems enable device manufacturers to improve yields, increase productivity and lower their manufacturing costs. The company maintains its headquarters in Milpitas, California, with sales and service offices worldwide.