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Posted: August 17, 2009
U.S. Customer Orders Strasbaugh nTellect Wafer Grinding System to Expand Capacity
(Nanowerk News) Strasbaugh announced today that a U.S. customer has placed an order for an nTellect (Model 7AF) wafer grinding system. The nTellect will expand the production capacity of a U.S. fab where two other nTellect grinders are already installed and in production.
"The nTellect is a production-proven wafer grinding system that offers customers improved surface finish, reduced sub-surface damage, repeatable thickness control and high reliability," said Mike Kirkpatrick, Strasbaugh's VP of Sales and Marketing.
The nTellect features advanced wafer grinding technologies, including force adaptive, in-feed grinding mechanics, linear-traversing grind spindles, real-time thickness measurement, and automated process control, which produce superior process results. The nTellect is well-suited for a broad range of applications including hard and exotic materials grinding. The system accommodates notched, flatted and round wafers and substrates ranging in size from 50mm to 200mm.
Strasbaugh has 60 years of leadership in design and manufacturing of advanced surfacing technology for the global semiconductor, silicon, data storage, MEMS, LED, telecommunications and optics industries. Through close alliances with premier manufacturers in these markets, Strasbaugh has developed pioneering technology that has become the standard in polishing and grinding today. Strasbaugh's state-of-the-art chemical mechanical planarization (CMP) systems, high quality prime wafer polishing and grinding tools, and leading edge process technologies, enable customers to realize their performance goals and has established the company as a world class provider of innovative, reliable, high-yield surfacing solutions.