Posted: October 1, 2009

Optrans Orders AIXTRON MOCVD Tool For InP Opto Devices

(Nanowerk News) AIXTRON AG announced today that in the fourth quarter of 2008, Optrans Corporation, Japan, placed an order for a CRIUS® reactor for the production of InP-based photodiodes, LEDs and other optoelectronic devices. The Close-Coupled Showerhead® (CCS) MOCVD tool is to be delivered in a multi 4 inch wafer configuration. Simultaneously, Optrans will receive an AIXTRON Argus multi-channel pyrometer that allows real-time surface temperature measurement and analysis. The unique design allows the customer to monitor the thermometric distribution across the whole of the MOCVD growth surface in the CCS system.
Kawasaki-based Optrans has acquired part of the InP microchip division of the Japanese company NTT-AT, which is a long-term customer of AIXTRON. The acquisition of the microchip division included research, prototypes, patents, laboratory staff and customers of NTT-AT.
Dr. Gako Araki, Vice President of Optrans, comments: “We have considerable experience with the AIXTRON CCS 19x2 inch wafer InP system that has given us excellent across-wafer and run-to-run uniformity at NTT-AT. Its ability to use all kind of precursors enables even growth at low temperature, which is beneficial for the device. It was therefore a straightforward decision to once again choose an AIXTRON CCS MOCVD tool to support our production target of 12,500 wafers per year by 2010. The newly ordered system should be perfect for the development and production of our new-generation InP photodiode and LED product ranges while offering the best Cost of Ownership”.
Established in 1987, Optrans Corporation has become a major force in Japan and worldwide as a developer of a wide range of opto devices. Headquartered in Japan but with offices in the USA, it manufactures high-end, custom-design optoelectronic devices and systems for OEMs. It has extensive internal custom engineering expertise and leading-edge manufacturing processes. Optrans’ product line also offers versatile original packaging for components such as UV-LEDs, visible LEDs, IR LEDs, point source LEDs, photodiodes and phototransistors.
Source: AIXTRON (press release)
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