Posted: February 10, 2010

NILCom Members Present Solutions and Services for Commercialization of Nanoimprint Lithography at nano tech 2010

(Nanowerk News) NILCom, a nanoimprint lithography consortium comprising companies and research organizations throughout the imprint lithography supply chain, will be exhibiting at nano tech 2010 held February 17-19 in Tokyo, Japan. NILCom will present solutions and services, which will drive the further commercialization of nanoimprint lithography. Five consortium members will highlight the latest equipment, material and process developments at booth C 13.
The NILCom booth at nano tech 2010 will host the following consortium members:
Applied MicroStructures (AMST), San Jose, Calif. USA (
Focus: Equipment and processes for NIL adhesion and release layers
EV Group (EVG), St. Florian/Inn, Austria (
Focus: Equipment for all imprint lithography processes - including ultra-violet NIL (UV-NIL), hot embossing (HE) and micro-contact printing
micro resist technology GmbH, Berlin, Germany (
Focus: Resists and working stamps for nanoimprint lithography
NIL Technology ApS, Lyngby, Denmark (
Focus: Stamps for all forms of nanoimprint lithography
PVA TePla AG, Feldkirchen, Germany (
Focus: NIL equipment for stamp cleaning and residual layer removal
About NILCom
Founded in 2004, NILCom is a consortium of imprint lithography supply chain companies and research organizations, working together to assist customers in advancing their ideas into a manufacturing environment. Through its total solution path, combining the members' diverse knowledge base and skill sets to deliver complete process solutions for imprint lithography applications, NILCom drives continuous improvement into all aspects of the imprint lithography supply chain. In addition to offering process solutions and continuous imprint infrastructure advances, NILCom educates the imprint lithography community, connecting it with new market trends, materials, systems, and processes.
Source: NILCOM (press release)
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