Posted: March 16, 2010

McGill and Tegal to Collaborate on Deep Silicon and Dielectric Etch Process Development for Microfluidic Systems

(Nanowerk News) Tegal Corporation, an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced it has received an order for a Tegal 110 S/DE DRIE tool from McGill University, a leading research university involved in developing biosensors, biochips and biomaterials using nanostructure methodologies. The Tegal 110 S/DE DRIE tool will ship in the current quarter, and will be installed in the McGill Nanotools – Microfab, located in Montreal, Canada.
The silicon DRIE tool order from this first-time Tegal DRIE customer was secured by Tegal following a thorough competitive evaluation process by McGill University.
“We are looking forward to engaging in a variety of productive collaborations with McGill University in their particular areas of expertise, which include the important field of BioMEMS devices and applications, and we believe this order is a testament to the strength of the 110 S/DE system,” said Paul Werbaneth, Vice President of Marketing and Applications at Tegal Corporation. “McGill’s strengths in multidisciplinary projects involving McGill’s Engineering, Science, and Medicine faculties, combined with Tegal’s strengths in deep silicon etching, and deep etching of dielectric materials, creates important synergies that we think will lead to the kind of effective, focused research which results in real value for both teams.”
“The addition of DRIE capabilities to our toolset will make the McGill Nanotools Microfab a fully equipped 150mm compatible MEMS fab,” said Dr. Matthieu Nannini, Microfab Manager. “This tool fits our needs for performance, versatility and small foot print. We are confident it will give us the opportunity to develop new processes and devices for a wide range of applications such as microfluidics, RF-MEMS, MOEMS and MEMS in general.”
The Tegal 110 S/DE system is a high-density plasma etch tool featuring an inductively coupled plasma etch reactor and magnetic plasma confinement. The tool can run Tegal’s patented SHARP – Super High Aspect Ratio Process, achieving etched feature aspect ratios of > 100:1 in production environments. Together with its high reliability, broad process windows, and high etch rates, the Tegal 110 S/DE system is a critical enabler for etching silicon (S) and dielectric (DE) films found in the MEMS/MOEMS, bio-tech, and hi-voltage markets. Tegal DRIE tools are presently employed in numerous research and development laboratories throughout the world, engaging in both commercial and academic research programs, and are also found in MEMS foundries and other dedicated commercial High Volume Manufacturing lines world-wide.
About Tegal Corporation
Tegal is an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices found in products like smart phones, networking gear, solid-state lighting, and digital imaging. The Company’s plasma etch and deposition tools enable sophisticated manufacturing techniques, such as 3D interconnect structures formed by intricate silicon etch, also known as Deep Reactive Ion Etching (DRIE). Tegal combines proven expertise with practical system strategies to deliver application-specific solutions that are robust and reliable, and deliver exceptional process quality and high yields at a lower overall cost of ownership. Headquartered in Petaluma, California, the company has more than 35 years of expertise and innovation in specialized technologies, over 100 patents, and an installed base of more than 1900 systems worldwide.
Source: Tegal (press release)
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