Posted: September 11, 2007

Rohm and Haas Purchases Coating Cluster from SUSS MicroTec for Resist and Spin-on Dielectric Qualifi(...)

(Nanowerk News) SUSS MicroTec (FWB:SMH) (GER:SMH) announced today it has received the first order for its new Gamma XPress coat / develop cluster from Rohm and Haas Electronics Materials, a world leader in the development and manufacture of electronic materials for the semiconductor markets. The system from SUSS MicroTec will be used by Rohm and Haas Electronic Materials to develop, characterize and optimize photodielectrics and both thick and thin photoresists. The SUSS Gamma XPress was chosen over alternative equipment due to its superior thick resist processing capability and its bridge tool design that permits concurrent handling of wafers with different sizes without mechanical changeover.
Thick resists and photodielectrics are enabling technologies for volume production in wafer level packaging, 3D Integration and MEMS, representing some of the main markets for both companies. The system is scheduled for installation in late 2007 at Rohm and Haas’ photoresist manufacturing site in Nigata, Japan.
“Bringing leading edge technology like InterVia™ photoresists and photodielectrics to market requires our development labs to work with next generation processing equipment,” says Mike Toben, Global R&D Director for Rohm and Haas Electronic Materials, Packaging and Finishing Technologies “Our goal in selecting a new coating cluster was finding a system with the combination of high throughput and state-of-the-art control, and we believe we have found that with the new Gamma XPress. The SUSS MicroTec tool will significantly enhance our R&D and customer modeling capabilities.”
“We are honored that Rohm and Haas, one of the leading photoresist manufacturers, has decided to qualify its innovative resist solutions on a coat/develop system from SUSS MicroTec," comments Rolf Wolf, managing director for SUSS Micro Tec’s lithography division. “With the Gamma XPress SUSS MicroTec has developed a new advanced coating cluster that combines efficient processing with flexible production setup, helping our customer to minimize the cost of ownership for the tool.”
About Rohm and Haas Company
Leading the way since 1909, Rohm and Haas is a global pioneer in the creation and development of innovative technologies and solutions for the specialty materials industry. The company’s technologies are found in a wide range of markets including: Building and Construction, Electronics, Food and Retail, Household and Personal Care, Industrial Process, Packaging, Paper, Transportation and Water. Our innovative technologies and solutions help to improve life everyday, around the world. Based in Philadelphia, PA, the company generated annual sales of approximately $8.2 billion in 2006. Visit for more information.
About Rohm and Haas Electronic Materials
Rohm and Haas Electronic Materials develops and delivers innovative material solutions and processes to the electronic and optoelectronic industries. Focused on the circuit board, semiconductor manufacturing, advanced packaging, and flat panel display industries, its products and technologies are integral elements in electronic devices around the world. Additional information about Rohm and Haas Electronic Materials can be found at
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, wafer bonders and probe systems as well as equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit
All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.
Source: SUSS MicroTec
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