Posted: May 23, 2008

Event Advisory: Distinguished Panel to Explore New Dimensions in Scaling at Applied Materials Symposium

(Nanowerk News) Progress in advanced semiconductor technology depends on the industry’s ability to continuously change and reinvent itself. On June 2nd Applied Materials, Inc. will host an evening of presentations and discussion exploring the strategies needed to scale device performance, functionality and cost for the next decade. A panel of industry executives will share their perspectives on advancements in lithography and patterning materials, new design layouts, 3D integration and novel packaging schemes that are expected to drive greater device densities and process efficiencies.
Titled “New Dimensions to Moore’s Law,” this important event will take place in conjunction with the prestigious International Interconnect Technology Conference (IITC) in Burlingame, CA.

Dan Hutcheson, VLSI Research

Chris Malachowsky, nVidia Corporation

Klaus Schuegraf, SanDisk Corporation

Scott Becker, Tela Innovations

Tom St. Dennis, Applied Materials

Where: The Hyatt Regency at San Francisco Airport,1333 Bayshore Highway, Burlingame, CA 94010  
When: Monday, June 2nd, 2008  
For event registration, please visit
Applied Materials, Inc. (Nasdaq:AMAT) is a global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live. Learn more at
Source: Applied Materials
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