Posted: June 17, 2008

NEXX Systems to Participate in IMEC's Industrial Affiliation Program on 3D Integration

(Nanowerk News) NEXX Systems, a leading provider of process equipment for advanced wafer-level packaging applications, today announced its participation in IMEC's Industrial Affiliation Program (IIAP) on 3D integration. As a member of this program, NEXX Systems will install a Stratus S300-FX electrodeposition system at IMEC's facility in Leuven, Belgium for joint research and development of the metallization of through silicon vias (TSVs) and micro-bumping. The TSVs and micro-bumps are fabricated with electrodeposition technology and play a key role in 3D integration.
"We are delighted to continue our partnership with NEXX Systems and are confident that the Stratus will give our partners leading-edge electrodeposition technology for 3D integration," explained Eric Beyne, program director of the Advanced Packaging and Interconnect Center at IMEC.
"3D integration is an exciting new technology that addresses the ever-increasing demands for smaller, more complex, electronic devices," said Richard Post, NEXX's CEO. "Our partnership with IMEC will enhance continuing efforts to develop robust, low cost electroplating solutions that will enable future products for consumer electronics as well as automotive, medical, and office networking applications."
About IMEC
IMEC is a leading independent non-profit research center in nanoelectronics and nanotechnology focusing on the next generations of chips and systems, and on the enabling technologies for ambient intelligence. IMEC is headquartered in Leuven, Belgium, and further information on IMEC can be found at
About NEXX
NEXX Systems brings exceptional technical expertise to advanced packaging and 3D integration. Our product lines provide the most efficient, yet affordable, systems of their kind: Apollo and Nimbus for multi-layer sputter deposition of metals, and Stratus for high throughput electro-deposition of metals. Additional information can be found at:

NEXX Systems

Richard S. Post, 978-932-2030

Chief Executive Officer

Source: NEXX Systems
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