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Posted: July 1, 2008
EV Group Named Among VLSI Research's 10 BEST Suppliers for Sixth Consecutive Year
(Nanowerk News) EV Group (EVG), based in St. Florian/Inn, Austria, is pleased to announce that the company has received the distinction of being ranked as one of the world's 10 BEST small suppliers of wafer processing equipment by VLSI Research, Inc.
Marking the sixth year in a row that EVG has been recognized for this honor, this award is based on the results of the recently completed VLSI Research 2008 Customer Satisfaction Survey, which gathered ratings on over 220 equipment suppliers.
"Receiving this distinction for the sixth consecutive year not only validates that we are highly committed to establishing and sustaining strong, ongoing relationships with our customers, it also demonstrates that we have consistently provided the same high-level of superior customer satisfaction for a significant amount of time," explained Hermann Waltl, EVG's senior vice president of sales. "We thank our customers for their continued support and confidence in our business. We will not only remain committed to improving our service and support, but strive to implement new, creative ways to best serve our worldwide customer base."
About the Survey
The VLSI Research annual Customer Satisfaction Survey on Chip Making Equipment is the only publicly available opportunity for chip manufacturers to provide feedback on their suppliers. The 10 BEST rankings award special recognition to the suppliers that are rated highest by their customers.
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at http://www.EVGroup.com.