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Posted: September 8, 2008
SUSS MicroTec Launches New Production Wafer Bonder for CMOS Image Sensor Market
(Nanowerk News) At this year's Semicon Taiwan, from September 9 to 11 in Taipei, SUSS MicroTec (FWB:SMH)(GER:SMH), a leading supplier of process and test solutions for the semiconductor industry, introduces the XBC300 Production Wafer Bonder for the CMOS Image Sensor (CIS) market. Visitors will have the opportunity to learn more about the world's first wafer bonder product family specifically designed for CMOS Image Sensor production.
The XBC300 is designed for 300mm wafer bonding for the integration and packaging of CMOS Image Sensors. The XBC300 performs a wide range of wafer bonding processes in the smallest footprint possible. The high throughput capabilities of the XBC300 combined with the smallest production footprint in the market today optimizes cost of ownership for CIS applications.
"For new applications like image sensors it is important to have dedicated solutions to ensure the highest throughput with the lowest cost of ownership, " said Wilfried Bair, VP Strategic Business Development, "we are excited to have the XBC300 to offer in this capacity."
About SUSS MicroTec
SUSS MicroTec listed in Deutsche Borse AG's Prime Standard is one of the world's leading suppliers of process and testing solutions for markets such as 3D Integration, advanced packaging, MEMS, nanotechnology and compound semiconductor. SUSS MicroTec enables its customers to increase process performance while reducing cost of ownership and to meet the volume requirements of fast growing markets with high quality solutions.
SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service.
Headquartered in Garching near Munich, Germany, SUSS MicroTec employs more than 730 employees worldwide.