Posted: October 1, 2008

AWLP Licenses Full Range of SHELLCASE Image Sensor Packaging Technologies From Tessera

(Nanowerk News) Tessera Technologies, Inc., a leading provider of miniaturization technologies for the electronics industry, announced today that Advanced Wafer Level Packaging Inc. (AWLP) has licensed the full range of SHELLCASE® image sensor packaging technologies from Tessera, including the SHELLCASE MVP solution, which is one of the industry’s first Through Silicon Via (TSV) solutions.
The market continues to demand increasingly thinner packages, higher yield, enhanced reliability and lower cost for image sensor packaging. Tessera’s SHELLCASE wafer-level chip-scale packaging (WLCSP) includes the latest advancements in image sensor packaging technology and delivers a high-yield, highly reliable manufacturing solution for image sensors used in next-generation mobile devices including mobile phones and PDAs.
“The market for image sensor packaging continues to grow rapidly, especially as it migrates to 2 mega pixel and above, where the benefits of our SHELLCASE technology really pay off in reducing module assembly yield losses,” said Michael Bereziuk, executive vice president, Imaging & Optics, Tessera. “AWLP shares our vision of this significant market opportunity and will create a new manufacturing site in a region that is driving the next-generation of imager and camera modules.”
AWLP is an early-stage start-up company based in Seoul, Korea. The new outsource packaging company will be dedicated to providing SHELLCASE packaging services to semiconductor manufacturing companies. While AWLP will specialize in image sensor technology, it will also offer packaging services for devices including micro-electromechanical systems (MEMS) and light sensors. For more information on AWLP, go to
“We are very happy to license WLCSP technology from Tessera as their top licensee in Korea,” said YJ Shim, chief executive officer, AWLP. “We will provide the newest, highest quality chip-scale packaging technology service to meet out customers’ image sensor packaging requirements.”
AWLP was established in 2007 as a foundry service provider dedicated to Tessera WLCSP technology. AWLP’s facility is now being built in Kwangju City and will begin production by the end of 1Q09.
Tessera’s industry-proven SHELLCASE wafer-level chip-scale packaging technology reduces costs and accelerates time-to-market. It incorporates a thin layer of glass at the wafer level, which is placed on top of an image sensor; an image sensor is a device that converts an optical image to an electric signal in digital cameras. The wafer is then diced and assembled into a module to protect it from contamination during the module assembly stage. This significantly improves manufacturing yields, which are affected by contamination, and enables manufacturers to run lower-cost manufacturing assembly processes by avoiding the need for expensive clean room facilities.
A conventional WLCSP is an integrated circuit (IC) package with an area no greater than 1.2 times that of the IC and is mounted on the IC at the wafer level. The SHELLCASE MVP solution provides a WLCSP the same size of the IC. It is one of the industry’s first to use Through Silicon Vias (TSVs), which are vertical electrical connections passing through a silicon wafer or die. TSVs allow 3D die-stacking of the image sensor on another IC by vertically integrating two or more die with a dense, high-speed interface.
The SHELLCASE MVP solution does not require modification or re-layout of the image sensor wafer, as previous generations required. It was qualified to JEDEC - Level 1, making it highly reliable and suitable for a wide range of applications beyond cell phone cameras. As one of the thinnest solutions available on the market, it enables very low profile camera modules, providing OEMs with greater design flexibility.
About Tessera
Tessera Technologies, Inc. is a leading provider of miniaturization technologies for the electronics industry. The company licenses its innovations, as well as delivers products based on these innovations to promote the development of the supply chain infrastructure, enabling manufacturers to get the right product to market, at the right time. Tessera is headquartered in San Jose, California. For information call 1.408.894.0700 or go to
Source: Tessera (press release)
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