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Posted: November 27, 2008
On-line Deposition Rate Measurement for Endpoint Detection in Sputter Processes
(Nanowerk News) At the 14th International Conference on Thin Films (ICTF 14) in
Belgium last week LayTec has presented the latest results of
on-line deposition rate measurements in sputter processes.
Dr. Steffen Uredat of LayTec reported on the application
for magnetic storage systems and MRAM at SINGULUS
Nano Deposition Technologies GmbH in Kahl, Germany.
Dr. Berthold Ocker and his team at SINGULUS use a LayTec
sensor to monitor the deposition rate of thick Al2O3 layers
on Si for end-point detection in a newly developed sputter
chamber with 10 x 8" substrates. Like all other LayTec
products, the sensor also determines optical properties (R, n,
k) and indicates surface roughness.
On-line deposition rate (red curve) and layer thickness (blue
curve) measurements during deposition of Al2O3 for end-point detection of 30 µm target thickness.
The figure above shows the data of an in-situ on-line deposition rate
measurement during deposition of 30 µm Al2O3 that can be
used to stop the growth at the targeted layer thickness.
Dr. Uredat also presented results gained by monitoring of thin
SiO2-SiNx-layer stacks for antireflection coatings deposited on
glass by reactive sputtering at Fraunhofer Institute of Electron
Beam and Plasma Technology (FEP) in Dresden, Germany.
Unlike the commonly used quartz crystal monitors, LayTec‘s
in-situ sensors measure directly on the thin-film surface and
provide information about deposition rate and surface morphology
on-line. In contrast to transmittance measurements,
they are applicable for opaque substrates as well and need
only one view-port.
For further information or a copy of Dr. Uredat‘s presentation
please contact [email protected]