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Posted: January 26, 2009
MultiProbe Launches Thermal Chuck for Advanced Technology Measurements at Elevated Temperatures
(Nanowerk News) AFP users that require testing in heated environments are now able to perform fault isolation techniques at elevated temperatures, mimicking the harsh conditions their companies final products will face.
MultiProbe™, the developer and manufacturer of the Atomic Force Nanoprober (AFP), announces the release of a Guarded Thermal Chuck. The unit has shown successful results in probing devices at all technology levels.
The Thermal Chuck does the job efficiently without altering image quality or probing experience, Says Anton Riley, Director of Engineering at MultiProbe. It allows users to localize soft failures to a single transistor, under thermal stress. This is a boon to automotive and car safety companies employing advanced technologies; the AFP with the Thermal Chuck in place recreates conditions in which failures can occur while identifying potential chip failures that might have otherwise gone undetected by other probing techniques.
The Thermal Chuck operates at a temperature range between ambient and 120°C. Itís compatible with up to 6 AFP probe heads and a CAD navigation precision stage and can monitor current with fempto amp resolution, or apply voltage for either a DC current image or an AC Scanning Capacitance image (SCM).
Located in Santa Barbara, CA, MultiProbe™ manufactures an automated Atomic Force Nanoprober that combines multi-scan fault isolation imaging with nanoprobing electrical capabilities. Forerunners in Failure analysis and microelectronic device development rely on MultiProbe™ tools to perform technology node measurements ranging from .25 micron down to 22nm and pushing.
For more information, please call Patrick Harrington: Tel:(805) 560-0404,x104 or (805)637-0042; URL: www.multiprobe.com