Posted: February 20, 2009

Molecular Imprints to Provide Updates on Progress on its S-FIL Technology

(Nanowerk News) Molecular Imprints, Inc., a market and technology leader for nanopatterning systems and solutions, today announced its line-up of global speaking engagements at upcoming nanotechnology industry conferences during the early part of 2009.
At these conferences, Molecular Imprints will present key findings and updates on the validation of its S-FIL® (Step and Flash® Imprint Lithography) technology for production applications in both the semiconductor and hard disk drive (HDD) industries. The company’s innovative S-FIL imprint lithography technology represents a key enabling technology in the production of next-generation high-density memory systems and devices, due to its superior resolution and low cost-of-ownership (CoO) characteristics.
SPIE Advanced Lithography Conference (February 22-27, 2009, San Jose, Calif.)
At the SPIE Advanced Lithography Conference, Molecular Imprints will review its progress across the spectrum of the S-FIL nanoimprint infrastructure, including: mask development, qualification and replication; nanopatterning; and process control. The company’s activities at the conference include the following:
Monday, February 23
  • Panel Discussion: “The Future—Where Will Reticles Be by the End of 2013?” (7:30 p.m.)
  • Wednesday, February 25 – Alternative Lithography Technologies Track
  • Oral Presentation: “Patterned media using Step and Flash Imprint Lithography” (1:40 p.m.)
  • Oral Presentation: “Recent developments in UV nanoimprint stepper technology for sub-30nm half-pitch lithography” (4:10 p.m.)
  • Oral Presentation: “High-resolution defect inspection of Step and Flash Imprint Lithography for 32nm half-pitch” (5:50 p.m.)
  • The Semico Summit (March 8-10, 2009, Scottsdale, Ariz.)
    At the Semico Summit, Mark Melliar-Smith, CEO of Molecular Imprints, will review the economic and technology challenges that HDD and solid-state non-volatile-memory manufacturers face in meeting their areal density and critical dimension (CD) roadmaps, as well as the requirements for low CoO patterning solutions to enable these manufacturers to scale to higher-density memory systems and devices.
    Monday, March 9
  • Keynote Address: “Meeting the Insatiable Demand for Storage” (3:00 p.m.)
  • DISKCON Asia Pacific (March 12-13, 2009, Singapore)
    At the DISKCON Asia Pacific Conference, Paul Hofemann, vice president of marketing and business development for hard disk drive (HDD) and emerging markets, will discuss the progression of nanoimprint lithography technology from the laboratory toward low-cost, high-volume patterned media manufacturing.
    Friday, March 13(Date and time tentative)
  • Oral Presentation: “From Possible to Practical – The Evolution of Nanoimprint Lithography for Patterned Media” (time TBD)
  • Photomask Japan (April 8-10, 2009, Yokohama, Japan)
    At the Photomask Japan Conference, Molecular Imprints will review progress being made in key areas of the imprint mask infrastructure—namely mask inspection and repair—at the 32nm node.
    Thursday, April 9 (Date and time tentative)
  • Oral Presentation: “Inspection and Repair for Imprint Lithography at 32nm” (10:10 a.m.)
  • Source: Molecular Imprints (press release)
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