Cadence delivers application specific kits and new-generation platforms of integrated design technologies and methodologies that help users address all aspects of electronics design in the nanometer era.
California Lithium Battery applies a new Argonne patented process to embed nano-silicon into graphene that Argonne tests show help to stabilize the silicon to create a superior lithium battery anode material.
A leading provider of cutting-edge technologies enabling researchers in the life sciences to create life-saving and enhancing medicines and diagnostic tests more quickly and efficiently. Caliper has compiled numerous best-in-class solutions and is aggressively innovating new technologies to bridge the gaps that exist in bringing in vitro assays to in vivo results and ultimately into cures for human disease.
Cancer Therapeutics, Inc. is a biotechnology business incubator, with a specific emphasis on disruptive treatments and nanotechnology. It seeks out disruptive cancer research and technology opportunities to invest in, develop, and commercialize. The end result will be therapies, treatments, and pharmaceuticals targeted at more efficiently and effectively attacking cancer.
The company has developed a unique process for the deterministic production of carbon nanotube (CNT) devices. This process allows Carbon Design Innovations to predictably produce CNTs with specified geometries and properties such as angle and length that offer many benefits for atomic force microscopes.
A a medical device company that has developed and is commercializing a proprietary wireless sensing and communication technology for the human body. The company's sensors are designed and manufactured using microelectromechanical systems, or MEMS, technology, which enables the fabrication of millimeter-scale devices with internal features in the nanometer to micrometer range.
A fabless semi-conductor IP company developing embedded Non-Volatile Memory technology for standard CMOS processes. Its Nanomech™ technology is a novel embedded flash solution, residing in the metal interconnect system, yielding no impact to existing IP, scaling to 45nm and below.