Posted: April 28, 2010 | |
SPEDOC project to work on future cancer diagnosis systems |
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(Nanowerk News) To continue the industry’s historical trend of performance scaling, SEMATECH experts reported on integrated approaches to CMOS logic and memory device technology and 3D TSV (through silicon via) manufacturing at the International Symposium on VLSI Technology, System and Applications (VLSI-TSA) on April 26-28, 2010. | |
In a series of eight research papers, an international team of SEMATECH researchers addressed the various challenges and process solutions for extending advanced memory and logic technologies. The papers, selected from hundreds of submissions, outlined leading-edge research in areas such as high-k/metal gate (HKMG) materials, flash memory, and planar and non-planar CMOS technologies. | |
“The processes, materials, and device structures that will define next generations of CMOS and non-CMOS technologies, and how they function when combined as a module, is of critical importance to enhance functionality and performance in future generations of devices,” said Raj Jammy, vice president of advanced technologies. “The research that was presented at VLSI-TSA demonstrates SEMATECH’s leadership and innovative thinking in new materials, processes and concepts that enable CMOS scaling and pave the way for emerging technologies.” | |
In one potentially industry-changing technology, Sitaram Arkalgud, director of SEMATECH’s 3D interconnect program, described a via-mid approach to TSV technology on a 300mm platform. Arkalgud discussed process development, module integration and the overall manufacturability outlook for via–mid TSV, a front-end process which allows a reduction in the interconnect length as well as an increase in bandwidth between the stacked chips, resulting in lower power, higher performance, and increased device density. | |
Additionally, SEMATECH front end process technologists reported technical advances in the following areas: | |
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The International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) is sponsored by the Institute of Electrical and Electronics Engineers, or IEEE, a leading professional association for the advancement of technology in association with Taiwan’s Industrial Technology Research Institute (ITRI). VLSI-TSA is one of many industry forums SEMATECH uses to collaborate with scientists and engineers from corporations, universities and other research institutions, many of whom are research partners. | |
About SEMATECH | |
For 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners. |
Source: SEMATECH |
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