An agreement of cooperation with investment company Nanostart AG, winner of the open competitive tender* to manage venture capital fund Kama Fund First, was signed today by RUSNANO CEO and Chairman of the Executive Board Anatoly Chubais, Perm Krai Governor Oleg Chirkunov, and Nanostart CEO Marco Beckmann.
Kilopass Technology, Inc., a leading provider of semiconductor logic non-volatile memory intellectual property, today unveiled Itera, the industry's first and only embedded multi-time programmable NVM in 40nm, during the Linley Tech Mobile Conference.
Oxford Instruments Magnetic Resonance, the supplier of intelligent NMR, announces that it will launch the new GeoSpec2 modular core analysis instrument at the 2011 SPWLA Symposium, to be held May 14-19, 2011 in Colorado Spring, CO.
To achieve the perfect combination of optics and AFM at the molecular scale, distortions must be prevented. This will result in two images, such as optical and AFM images, that do not perfectly overlay. Reasons for distortions include aberrations arising from the lenses and mirrors of the optics system. To generate a seamless overlay of both techniques, JPK developed a cutting-edge calibration method, called DirectOverlay, which uses the accuracy of the AFM closed-loop scanning system to enable a true display of absolute angles and length coordinates.
EV Group today announced that its longtime customer and partner, industry-leading research center CEA-Leti, has installed multiple EVG tools in its industry-first 300-mm cleanroom dedicated to R+D and prototyping for 3D-integration applications.
The Company awarded its newly launched BIND SCANNER to the laboratory of John Lambris and Daniel Ricklin at the Department of Pathology and Laboratory Medicine at the University of Pennsylvania. The award was chosen on scientific merit including the level of innovation and the degree to which label-free biosensors could significantly advance breakthrough research in basic and applied science as well as in drug discovery.
Applied Seals North America, Inc. has opened a new applications and design center at its headquarters in Silicon Valley, increasing the company's capabilities in troubleshooting customers' problems with o-rings and other seals, prescribing the best application-specific solutions and designing leading-edge seals for the 22 nm technology node of semiconductor manufacturing.
To address the increasing activity of NT-MDT Co. on the US and world markets of scanning probe microscopy equipment, the company has invited the experienced AFM developers and practitioners: Sergei Magonov, John Alexander and Sergey Belikov to form the research unit NT-MDT Development in Tempe, Arizona.
RUSNANO has made its first co-investment in a project to expand production of ESTO-Vacuum automated vacuum units. The project has a total budget of one billion rubles. RUSNANO will co-invest 198.5 million rubles in the project. ESTO-Vacuum expects to reach design capacity of 60 units per year in 2016.
The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, providing a high-capacity, small form factor storage option for saving music, video, books and other data on smartphones, tablets and computing solutions such as solid-state drives (SSDs).
British-based AECOM, Inc. and the University of Wisconsin-Milwaukee (UWM) have signed a Memorandum of Agreement to explore potential areas of research collaboration in the rapidly growing area of nanotechnology in building materials.
GMZ Energy Inc., a maker of thermoelectric materials based on nanotechnology developed at MIT, has raised $7 million from a planned $13 million investment round, the first institutional round for the company.
Shrink Nanotechnologies, Inc., an innovative high technology company announced that critical intellectual property for Shrink's Cell Align cell culturing and tissue engineering material, along with a novel higher performing immunoassay substrate has been filed with the US Patent and Trademark Office.
By working together to further co-develop Addressable Memory technology, PARC and Thinfilm are complementing each other's strengths to move the industry beyond components and devices towards consumer-facing applications.