Asylum Research, Oak Ridge National Laboratory (ORNL), and R+D Magazine have announced that the new Ztherm Modulated Local Thermal Analysis Option for Asylum's MFP-3D and Cypher Atomic Force Microscopes has been awarded the R+D100 Award for 2010.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG520IS semi-automated wafer bonding system and EVG620TB mask and bond aligner from the University of Texas at Arlington (UTA).
The focus is on basic research in the field of advanced high-performance materials with customized properties, which play a key role in numerous areas of innovation, such as information and communications technology, catalysis, and energy, environmental and automotive engineering.
This August, JEOL USA will demonstrate the first correlative microscope to enable concurrent light microscopy and atmospheric scanning electron microscopy (ASEM) for observation of and experimentation on samples in their native state.
P2i, a world leader in liquid repellent nano-coating technology, has acquired 100 per cent of the share capital of Surface Innovations Ltd, a UK-based technology company with a wide range of functional nano-coating patents.
The Integrated Nano-Science and Commodity Exchange provides the world's only source of accredited, compliant and validated engineered nanomaterials available on any exchange. INSCX exchange has authorised the issuing of a series of calls to Global Nanobusiness and Member States as a means to further drive trade in (SHE) compliant nanomaterials.
Micron Technology, Applied Materials, and Ultratech have joined the imec industrial affiliation program (IIAP) on GaN-on-Si technology. This multi-partner R+D program focuses on the development of GaN-on-Si (gallium nitride-on-silicon) process and equipment technologies for manufacturing solid state lighting (e.g. LEDs) and next-generation power electronics components on 8-inch Si wafers.
Crossing Automation, Inc., a leading supplier of efficient, cost-effective front-end and back-end automation solutions and engineering services to high volume semiconductor equipment manufacturers, today announced that it has received an order for its ExpressConnect integrated automation platform.
Today, HamaTech APE GmbH introduced the latest addition to its Next Generation Lithography line of mask integrity platforms, the MaskTrack Pro Bake/Develop (BD). The product addresses the challenges of mask manufacturing of advanced 193i Optical Immersion and Extreme Ultraviolet Lithography (EUVL).
Applied Materials, Inc. will showcase its leadership and innovation for producing future generations of microchips and clean energy solutions at the Semicon West 2010, Intersolar North America and ASMC (Advanced Semiconductor Manufacturing Conference) events in San Francisco this week.
Applied Materials, Inc. today announced that it has signed a comprehensive, five-year contract to service all Applied Materials chip production equipment at NXP Semiconductor's facility in Nijmegen, Holland.