Nagoya Institute of Technology Orders AIXTRON Black Magic II CVD tool
The order for the tool was received in the first quarter of 2009 and will be delivered in a 2 inch wafer configuration.
Jun 9th, 2009
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Picosun Organizes Its First Ever World Forum
Picosun Oy, Finland-based global manufacturer of state-of-the-art Atomic Layer Deposition (ALD) systems, organizes its first ever World Forum in the Greater Helsinki area of Finland from June 9th to 10th.
Jun 9th, 2009
Read morenanoTox Appoints Gov. George Allen to Board of Directors
nanoTox, the first company to provide complete risk assessment exclusively for nanoparticles, announced today that Governor George Allen of Virginia has joined the board of its parent company, Nano Risk Assessment, Inc.
Jun 8th, 2009
Read moreDiscera Expands MEMS Oscillator Product Line with Industrial Temperature Parts
PureSilicon oscillators now more cost-effective than conventional crystal devices.
Jun 8th, 2009
Read moreModumetal to Unveil Nanolaminated and Functionally-Graded Coatings for Corrosion Application
Modumetal to unveil new corrosion resistant coatings technology at 'Mega Rust' conference in Norfolk, Virginia.
Jun 8th, 2009
Read moreFRT Presents New Affordable Optical Tool for Non-Contact Film Thickness Measurements
FRT presents a new optical film thickness measuring tool at this year's Laser 2009 in Munich. The new MicroSpy FT non-destructively measures coatings that transparent or semi-transparent in the visible and near-infrared spectrum of light.
Jun 8th, 2009
Read moreRUSNANO Announces New Co-Investor in Nanotechnology-Based Lighting Project
During a meeting at the St. Petersburg Economic Forum, Anatoly Chubais, RUSNANO CEO, and Vyacheslav Shtyrov, President of Republic of Sakha (Yakutia), decided to include OJSC Republican Investment Company (RIC) as a co-investor for the project titled Solid-State Lighting: New Generation of Environmentally Friendly and Energy Efficient Nanotechnology-Based Lighting.
Jun 8th, 2009
Read moreMDRNA Reports Demonstration of Effective Localized Delivery of a UsiRNA to a Solid Tumor
MDRNA, Inc. announced today in vivo data from a bladder cancer model demonstrating effective localized delivery of a UsiRNA to a solid tumor, thus further expanding the delivery capabilities of the DiLA2 Platform.
Jun 8th, 2009
Read moreAposense Technology for Molecular Imaging of Apoptosis to Be Used by GlaxoSmithKline in Experimental Oncology Studies
[18F]-ML-10 to be evaluated by GSK to indicate treatment response in clinical trials.
Jun 8th, 2009
Read moreSTMicroelectronics Introduces a New Family of Single- and Two-Axis MEMS Gyroscopes
Applying field-proven performance and reliability to gyroscopes for enhanced user interfaces, gaming, GPS navigation, and camera-image stabilization.
Jun 8th, 2009
Read morePark Systems Develops Time-Resolved Photocurrent Mapping
Building upon the strength of its state-of-the-art conductive-AFM options, Park Systems has developed a ground-breaking capability of Time-Resolved Photocurrent Mapping
Jun 8th, 2009
Read moreCarl Zeiss Introduces Dual Camera Module to Capture Fast Intracellular Processes
Multichannel images captured simultaneously with maximum resolution.
Jun 5th, 2009
Read moreReal-time Measurement of Physiological Parameters in Living Cells
A new software module from Carl Zeiss enables real-time image capture and measurement of physiological parameters in living cells both during microscopic observation (online) and afterwards (offline).
Jun 5th, 2009
Read moreFirst Thin-Film Solar Module Factory Uses Linde's Award-Winning Fluorine Technology
Successfully eliminates the use of major greenhouse gas in thin-film photovoltaic module manufacture.
Jun 5th, 2009
Read moreNovellus' Sub-45nm HDP Gapfill Process Provides 3x Reduction in Median Defect Density
SPEED max process has 50 percent fewer out-of-control particles compared to current gapfill technologies.
Jun 5th, 2009
Read moreEV Group Gets Order From Leading RF Components Manufacturer EPCOS
EV Group today announced that EPCOS - a leading electronic components, modules and systems manufacturer - selected EVG's fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS's production facility based in Munich, Germany.
Jun 4th, 2009
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