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Electric current moves magnetic vortices

Faster, smaller and more energy efficient ? that is what tomorrow's computers should look like. This means that data needs to be written and processed faster. Physicists are now a great deal closer to that goal.

Posted: Mar 12th, 2014

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Metallurgical challenges in microelectronic 3D IC packaging technology

3D IC stacking is the most promising way to extend the limit of the miniaturization of large-scale-integration of 2D circuits on Si chips. A new paper discussed some major metallurgical challenges in microelectronic 3D IC packaging technology. It provides a deep insight of the further efforts needed in developing this technology.

Posted: Mar 11th, 2014

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Bending the light with a tiny chip

A tiny silicon chip designed by Caltech researchers eliminates the need for bulky and expensive lenses, and instead projects the image electronically by 'bending the light' with no mechanically moving parts.

Posted: Mar 11th, 2014

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