Researchers have discovered that creating a graphene-copper-graphene 'sandwich' strongly enhances the heat conducting properties of copper, a discovery that could further help in the downscaling of electronics.
Faster, smaller and more energy efficient ? that is what tomorrow's computers should look like. This means that data needs to be written and processed faster. Physicists are now a great deal closer to that goal.
In an effort to better understand the challenges stalling the electric car, an international research team has been investigating batteries and battery materials and have revealed a new underlying mechanical interaction that occurs during the carbon coating process.
Biomedical engineering researchers have developed a new technique that uses adenosine-5'-triphosphate (ATP), the so-called 'energy molecule', to trigger the release of anti-cancer drugs directly into cancer cells.
CEA-Leti announced today it has fabricated ultra-scaled split-gate memories with gate length of 16nm, and demonstrated their functionality, showing good writing and erasing performances with memory windows over 6V.
3D IC stacking is the most promising way to extend the limit of the miniaturization of large-scale-integration of 2D circuits on Si chips. A new paper discussed some major metallurgical challenges in microelectronic 3D IC packaging technology. It provides a deep insight of the further efforts needed in developing this technology.
A tiny silicon chip designed by Caltech researchers eliminates the need for bulky and expensive lenses, and instead projects the image electronically by 'bending the light' with no mechanically moving parts.
Scientists at Oak Ridge National Laboratory recently discovered an unanticipated factor in the performance of polymer-based solar devices that gives new insight on how these materials form and function.