Genetic Immunity has announced that Julianna Lisziewicz, Chief Executive Officer of the Company, will be presenting at the Bio International Convention, to be held from May 18-21, 2009 in Atlanta, Georgia.
Nanosys Inc. and QuantuMDx Group (QMDx) today announced that QMDx has signed a non-exclusive license agreement with Nanosys for several patents and patent applications related to the use of nanowires for biosensors.
CombiMatrix Corporation today announced that Dr. Amit Kumar's presentation at the DxRx Summit: Nucleic Acid Diagnostics and Therapeutics in Boston, Massachusetts, held on May 13, 2009 is now available on its website. The presentation titled, 'Non-Invasive, Array-Based Screening for Cancer' can be downloaded and reviewed by interested parties.
The Petri Dish Heater is designed for studies of living and fixed cells and other biological studies where heating in either an open or sealed environment at physiologically-relevant temperatures is desired.
The Mountains Surface Analysis Business Unit of Digital Surf, the surface metrology solutions provider, announced the release of a new software module, Advanced Contour, which is part of the Mountains surface analysis software suite.
Leica Microsystems has released a new module within the Leica Application Suite (LAS): LAS Image Analysis is a sophisticated software module that automatically performs feature detection, measurement and the evaluation of multiple image features.
Sigma-Aldrich today introduced Precisio Kinases, a new collection of high quality active kinases that is expected to enable scientists to achieve greater insight into protein phosphorylation and cell signaling.
Die Nanostart-Beteiligung Nanosys hat die Gruendung der Tochter QD Soleil bekannt gegeben. QD Soleil wird sich ausschliesslich auf die Anwendung der von Nanosys entwickelten Nanotechnologie zur Herstellung von Solarzellen konzentrieren.
Developed as part of a cooperative agreement between KLA-Tencor and Timbre Technologies, Inc., this new software package leverages the strength of the two industry leaders to enable metrology engineers in IC fabs to measure the dimensions of 3D logic and memory structures, such as FinFETs , bulb RCATs, and structures created by the advanced patterning technique called spacer pitch splitting.