PI (Physik Instrumente) L.P. - a leading manufacturer of piezo-based precision motion-control equipment for engineering, nanotechnology, photonics and semiconductor applications - introduces the new P-876 line of piezo composite patch transducers.
Sensory Analytics, an emerging leader in non-contact and non-destructive coating measurement systems, today announced the introduction of its revolutionary new SpecMetrix RA Coating Quality Assurance Cells.
mPhase Technologies, a technology company with subsidiaries focused on a green smart nanobattery which provides power on command, AlwaysReady, Inc., today announced that its CEO, Ronald A. Durando will present at Friedland Investment Events' Global Equities Conference in Las Vegas, Nevada on Tuesday October 16, 2007.
Acrongenomics, Inc. and its research partner Molecular Vision Ltd. have announced the successful implementation of a fully functional, portable medical diagnostic demonstrator of their Lab-on-a-Chip technology.
Industrial Nanotech, Inc. today that the Company has severed its relationship with Mercatus & Partners Group, of Rome, Italy as joint venture partners for a manufacturing facility in Italy and is moving to expand the Company's supply chain for Europe, the Middle East, and Asia with manufacturing in Budapest, Hungary and a fulfillment center in Shanghai, China.
DuPont today introduced DuPont Light Stabilizer 210, a product designed as sun protection for plastics. The product uses extremely small particles of titanium dioxide to efficiently absorb ultraviolet light, protecting plastic and anything it covers from the sun's damaging rays.
Hitachi, Ltd. and Hitachi Global Storage Technologies announced today they have developed the world's smallest read-head technology for hard disk drives, which is expected to quadruple current storage capacity limits to four terabytes on a desktop hard drive and one TB on a notebook hard drive.
EV Group, a leading supplier of wafer bonding and thin-wafer processing equipment for advanced semiconductors, MEMS and nanotechnology, has announced that a major Austrian semiconductor manufacturer has selected and installed an EVG850TB fully automated temporary bonding system for high-volume processing of thin- and ultra-thin device wafers.
The planar patch clamp technology used in a family of automated electrophysiology products developed and marketed by Nanion Technologies GmbH in Munich, Germany, is among four technological and scientific innovations that have been nominated for this year's Deutscher Zukunftspreis (German Future Award).
RASIRC, the steam purification company, will present poster #76, Trace Metal Removal Efficiency of a RainMaker Humidifier at the 31st Annual Fuel Cell Seminar & Exposition being held in San Antonio, TX, October 15-19, 2007.
IBM and its joint development partners -- AMD, Chartered Semiconductor Manufacturing Ltd., Freescale, Infineon, and Samsung -- today announced an innovative approach to speed the implementation of a breakthrough material known as 'high-k/metal gate' in next generation 32 nanometer (32nm) computer chips.
Raymor Industries Inc. is pleased to announce that further to its annual general meeting held on the 19th of September, 2007, the shareholders approved the election of six new individuals to its board of directors until the next annual general meeting.