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Posted: Nov 05, 2013
Call for papers announced for the 2014 Symposia on VLSI Technology and Circuits
(Nanowerk News) The official Call for Papers have been issued for the 2014 Symposia on VLSI Technology and Circuits to be held at the Hilton Hawaiian Village June 9-12, 2014 (Technology) and June 10-13, 2014 (Circuits). The deadline for paper submissions to both conferences is January 27, 2014. Late-news paper submissions deadline for the Symposium on VLSI Technology is March 27, 2014; there is no late-news submission for the Symposium on VLSI Circuits. Complete details for paper submission can be found online at http://www.vlsisymposium.org/authors/.
Linked for the past 26 years, the annual Symposia on VLSI Technology and Circuits provide the opportunity for the world’s top device technologists, circuit and system designers to engage in an open exchange of leading edge ideas at the world’s premier mid-year conference for microelectronics technology. Since 1987, the Symposia on VLSI Technology and Circuits have been held together, alternating each year between sites in the US and Japan, making it possible for attendees to learn about new directions in the development of VLSI technology & circuit design through some of the industry’s leading research and development presentations.
The comprehensive technical programs at the two Symposia are augmented with short courses, invited speakers and several evening rump sessions. As a new highlight, the Symposia have introduced joint technology and circuit focus sessions in 2012, consisting of invited and contributed papers on topics of mutual interest to attendees.
The Symposium on VLSI Technology seeks breakthroughs in devices and processes including:
Advanced gate stacks, channels, junctions, and contacts
Interconnect scaling and Cu alternatives; chip-to-chip including optical interconnects
Heterogeneous integration of non-Si materials/substrates on Si substrates
Advanced lithography and high-density VLSI patterning technologies
Beyond-CMOS functional devices with a path for VLSI implementation
Packaging technologies, through-silicon-vias (TSVs) and 3D-system integration
Advanced materials, device analysis, and modeling
Theoretical understanding, operation fundamentals and reliability issues related to the above devices
VLSI manufacturing concepts and technologies and yield optimization
The Symposium on VLSI Circuits seeks papers showcasing innovations and advances in the following areas:
Digital circuits and processor techniques, including circuits and techniques for standalone and embedded processors
Memory circuits, architectures, and interfaces for volatile and non-volatile memories, including emerging memories
Clock generation and distribution for high-frequency digital and mixed-signal applications
Analog and mixed-signal circuits, including data converters, sensor interface circuits, and amplifiers
Wireline receivers and transmitters, including circuits for inter-chip and long-reach applications
Wireless receivers and transmitters, including circuits for WAN, LAN, PAN, BAN, and inter-chip applications
Power management circuits, including battery management circuits, voltage regulators, energy harvesting circuits, and circuits for renewable energy applications
Application-oriented circuits and VLSI systems, including biomedical applications, and including SoC and SiP architectures and implementations
Joint technology and circuits focus sessions with invited and contributed papers highlighting major innovations and advances in materials, processes, devices, integration, reliability and modeling in the areas of advanced memories, 3D TSV integration, impact of technology scaling on advanced circuit design. Submissions are strongly encouraged in the following areas of joint interest:
Design in scaled technologies: Impact of advanced devices, structures, materials and interconnects on digital circuit performance, power, density; device design & process/technology optimization for analog/mixed-signal circuits
Design enablement: Technology and design co-optimization for improved performance, yield, reliability, ultra-low voltage/power operation, density, and cost
Memory technologies: Discrete and embedded SRAM, DRAM and NVRAM technology/design co-optimization
3D-integration (TSV): 3D-technologies and system co-optimization; power delivery and management; thermal management; inter-chip communications
Best Student Paper Award
Based on the quality of the papers and presentations, an award for best student paper at the Symposia will be chosen, and the recipient will receive a financial prize, travel cost support and a certificate at the opening session of the 2015 Symposium. For a paper to be reviewed for this award, the author must be enrolled as a full-time student at the time of submission, must be the lead author and presenter of the paper, and must indicate on the web submission form that the paper is a student paper.