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Park NX-Wafer for Wafer-Fab Manufacturing Fully Automates Semiconductor Industry's Bare Wafer Automated Defect Review Process, Increases Throughput by 1,000 Percent

Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry. This fully automated defect review and identification system enables a critical inline process to classify defect types and source their origin through high resolution 3D imaging only available at Park Systems, the world's leading AFM provider.

Jul 14th, 2014

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