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Henkel Launches Wafer Backside Coating Technology for Stacked Die Packages

Recognized for its ease of use and cost-effectiveness with die attach processes for leadframe packages, Henkel has extended its Wafer Backside Coating (WBC) portfolio to also include a solution for stacked die packages. Ablestik WBC-8901UV has been designed to address the demanding requirements of multiple die stack applications for the memory market segment, including packages such as TSOPs, MCPs and FMCs (Flash Memory Cards).

Posted: Aug 2nd, 2010

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EcoloCap Solutions Announces Contract Negotiations for its Nano Battery in India

EcoloCap Solutions Inc., an integrated network of environmentally-focused technology companies utilizing nanotechnology to develop efficient alternative energy solutions, today announced that Michael Siegel President and CEO of Ecolocap Solutions, Inc. on a week-long visit to India has reached an agreement in principle with Ajay Singh, managing director of Spice Jet.

Posted: Jul 30th, 2010

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