Axcess International Inc., a leader in wireless credentials, today announced it has secured a contract for providing a wireless ID system in support of advanced workforce management applications that will improve the safety of workers on a large oil platform in the Far East.
BASF has created an advanced copper plating chemistry for current and future generation chip technologies. The innovative chemical solution, which is the direct result of the joint development program with IBM started in June 2007, outperforms other commercially available chemistries.
Carl Zeiss Industrial Metrology celebrated the official grand opening of the West Coast Tech Center (WCTC) in Irvine, California on Tuesday, April 6 and Wednesday, April 7. Set up as a production inspection facility with metrology systems running in a process support role, the two-day metrology event offered visitors a unique experience.
Olympus has today introduced the new cellSens software for life science imaging applications. Consisting of three different packages: cellSens Entry, cellSens Standard and cellSens Dimension, all user requirements can be met with ease.
Celator Pharmaceuticals today announced data from animal studies demonstrating the superior bone marrow uptake of CPX-351 (Cytarabine:Daunorubicin) Liposome Injection, its lead clinical-stage program, as well as the enhanced circulation kinetics and efficacy of its preclinical hydrophobic docetaxel prodrug nanoparticle (HDPN) formulation were presented at the 101st Annual Meeting of the American Association for Cancer Research.
Intersil Corporation, a world leader in the design and manufacture of high-performance analog and mixed-signal semiconductors, today announced that it will donate a high-technology semiconductor wafer fabrication facility and the land it occupies to the University of Central Florida.
CRAIC Technologies, the leading manufacturer of UV-visible-NIR microscopes and microspectrometers, is pleased to announce the 20/20 FPD microspectrophotometer. The 20/20 FPD is designed for colorimetry and light intensity comparison of microdisplays of all types.
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D interconnect program outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010 Materials Research Society (MRS) Spring Meeting on April 5-9.