Selah Technologies, an advanced materials manufacturer, announced today that the company has received an additional $50,000 SBIR Phase IB grant from the National Science Foundation (NSF) to fund continued development activities for the company's Selah Tubes nanotechnology.
On the basis of the initial data, two committees observed a clinical benefit but also more frequent and more severe pulmonary adverse events than expected and have thus recommended suspension of the trial, given the incidence of this type of effect.
The US Department of Energy has awarded nGimat a Small Business Innovation Research Phase I to develop electrode nanomaterials for high-performance Lithium-ion batteries that will be used to power the next generation of hybrid-electric vehicles.
Surface Technology Systems plc, a leader in plasma process technologies required in the manufacturing and packaging of micro electromechanical systems and advanced electronic devices, today announced that they have sold a Pegasus Deep Reactive Ion Etch tool to Freescale Semiconductor.
Mattson Technology, Inc., a leading supplier of advanced semiconductor process equipment used to manufacture integrated circuits, and Synopsys, Inc., a world leader in software and IP for semiconductor design and manufacturing, today announced a collaboration to offer calibrated process models for flash annealing equipment used on the 45-nanometer node and beyond.
Applied Materials, Inc. today announced its Applied Endura Extensa PVD, the industry's only production-worthy system for depositing the critical barrier films for copper interconnects in sub-55nm memory chips.
ASML Holding NV announces today its newest TWINSCAN XT:1950i lithography system - increasing the performance of its immersion lithography systems by 25%. The system offers improved overlay, resolution and throughput, to enable high-volume manufacturing of more powerful 38 nanometer memory and 32 nm logic semiconductors.
At Semicon West 2008, SUSS MicroTec unveils the second generation of its MA300 Production Mask Aligner featuring a dedicated alignment kit for creating 3D interconnects for applications like chip stacking and 3D image sensor packaging.
Aspen Aerogels today held the ribbon cutting for a new, $30 million, state-of-the-art manufacturing facility that has brought dozens of well-paying jobs to East Providence and plans for future expansions.
Sand 9, Inc., a start-up company developing advanced nano-mechanical resonator technology for the wireless device market, today announced it has completed an $8 million Series A round of financing led by new investor Flybridge Capital Partners.