At this week's VLSI circuits Symposium in Kyoto, imec and Renesas Electronics Corporation, unveiled the world's first multi-standard radio frequency receiver in 28nm CMOS technology, and a 28nm analog-to-digital converter targeting wide-bandwidth standards such as LTE-advanced and next-generation WiFi.
State technology enterprise Rusnano laid out new plans on Thursday to lure $5 billion in investment to Russia's technology sector over the next six years after opting out of a previously planned stock exchange listing.
Angstron Materials Inc., took delivery of specialized HVAC and dehumidification equipment early this year to complete new dry rooms in building space adjacent to its manufacturing facility. The dry rooms provide a controlled environment for accelerated development and production of Angstron's nano graphene anode material for high performance batteries.
CTI has advised that further testing of the graphene paper will include measuring the thermal transport properties which will allow them to optimize the graphene/bucky paper for heat sinks and heat dissipating applications.
DryWired's surface modification technologies receive positive results from third party facility Quanta Laboratories after a rigorous weeklong examination of DryWired nano-coating's resistance to humidity, salt, water, dust and contaminants.
BioNano and collaborator Pui-Yan Kwok, M.D., Ph.D., Henry Bachrach Distinguished Professor at the University of California, San Francisco (UCSF), will present the first demonstration of a de novo map of the human genome using the Irys System and the utility of this map in the analysis of structural variation and genome finishing.
NEA's patented Nanotechnology will be used in effort to create new hand-held analyzer system to detect a range of Volatile Organic Compounds (VOCs), including toxic and deadly materials in food and plants.
The Fraunhofer Institute for Solar Energy Systems ISE today announced that it has joined forces with EV Group to develop equipment and process technology to enable electrically conductive and optically transparent direct wafer bonds at room temperature.