FEI Company, a leading provider of high-resolution imaging and analysis systems, announced today the installation of a solution based upon FEI?s Tecnai Spirit cryo-transmission electron microscope (TEM) and three-dimensional (3D) tomography software at Sun Pharmaceutical Industries, Ltd.
IBM, Chartered Semiconductor Manufacturing Ltd., Samsung Electronics, Co., Ltd., and ARM today announced they will develop a comprehensive 32 nanometer (nm) and 28nm Systems-on-a-Chip (SoCs) design platform based on high-k metal-gate (HKMG) technology from the IBM-led joint-development alliance.
With state-of-the-art single-wall carbon nanotube manufacturing and processing equipment as a backdrop, Norman-based SouthWest NanoTechnologies Inc. (SWeNT) welcomed nearly 200 guests to celebrate the dedication of the company?s new 18,000-square-foot, $3.9 million facility.
The New England Chinese Information and Networking Association (NECINA) announced its inaugural U.S.-China Clean Technology Exchange Conference, scheduled for Saturday, October 18 in Chelmsford, Mass. Coinciding with the launch of the NECINA CleanTech Forum (NCTF), the conference will feature speakers who are leading some of the most important clean technology initiatives in the U.S. and China.
Despatch Industries, a leading provider of process technology for the production of carbon fiber, will be presenting at the Global Outlook for Carbon Fiber 2008, taking place September 30 through October 2 in Hamburg, Germany.
On October 2nd, the IEEE Santa Clara Valley-Electron Devices Society and Applied Materials will host a technology forum to explore the state-of-the-art photovoltaic cell and manufacturing technologies that are changing our world.
Malvern Instruments has launched the Zetasizer APS, a new dynamic light scattering (DLS) system which automates size measurements of samples in 96- or 384-well microplates. Designed primarily for protein specialists, the new system is fully automated, simply requiring users to insert the plate and press start.
I-Flow Corporation, through its wholly-owned subsidiary AcryMed Inc., announced today that it has received 510(k) clearance from the Food and Drug Administration (FDA) on its oxygen enriched topical hydrophilic closed cell foam wound dressing.
Quantum Leap Packaging, Inc., a leading provider of high performance air cavity packages for semiconductor assembly, received best session paper for 'High Frequency Packaging of RF Devices' at the IMAPS Advanced Technology Workshop on RF and Microwave Packaging in San Diego.
Ascent Solar Technologies, Inc. (NASDAQ:ASTI), a developer of state of the art flexible thin-film photovoltaic modules, today announced the signing of a definitive Cooperation Agreement with Texsa S.A. of Spain.