Das Fraunhofer-Institut fuer Schicht- und Oberflaechentechnik IST hat erfolgreich eine COST Action zum Thema 'hochionisierte gepulste Plasma Prozesse - HIPP Prozesse' initiiert und uebernimmt nun die Leitung dieser Aktion.
h+ magazine, a quarterly online periodical covering the news and obsessions of fans of radical technological change - a scene sometimes called 'transhumanism' - is going into print with its fourth issue.
The European Cooperation in Science and Technology (COST) invites researchers throughout Europe to submit proposals for research networks and use this unique opportunity to exchange knowledge and to embark on new European perspectives.
Researchers from the London Centre for Nanotechnology (LCN) and University College London (UCL) have fabricated sub-30 nm luminescent features of an organic semiconductor via spatially selective conversion and patterning of its precursor by using a heatable, micron-size scanning probe
Recent years have witnessed advances in direct-method research on protein crystallography obtained by the research team led by Academician Fan Haifu from the Institute of Physics, Chinese Academy of Sciences.
The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced the launch of a 3-Dimensional (3D) Through-Silicon Via (TSV) consortium to boost next generation 300mm wafer manufacturing capability for Singapore semiconductor industry to meet technology and product needs.
The European Commission's Directorate-General for Research has published a call for tenders for the assessment of impacts of NMP (Nanotechnology, materials, processes) technologies and changing industrial patterns on skills and human resources.
IBM scientists have demonstrated a promising and practical method that effectively eliminates the mechanical wear in the nanometer-sharp tips used in scanning probe-based techniques. This discovery can potentially be used in the development of next generation, more advanced computer chips that have higher performance and smaller feature sizes.