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Innovative Through-Silicon Via Technology Implemented in High-volume MEMS Production

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications, is the world's first manufacturer to have implemented Through-Silicon Via technology (TSV) in high-volume MEMS production.

Posted: Oct 11th, 2011

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ARM and UMC Extend Long-Term IP Partnership into 28nm

ARM and UMC, a leading global semiconductor foundry, today announced a long-term agreement that provides UMC foundry customers with access to the latest advanced ARM Artisan Physical IP solutions validated on UMC's 28HPM process technology.

Posted: Oct 6th, 2011

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RUSNANO and I2BF Global Ventures Invest in Ultracapacitor Manufacturer Nesscap Energy

Proceeds from this financing will be used as to approximately $15,000,000 for the establishment of a full scale production facility for ultracapacitors and fundamental research center in the Russian Federation and as to approximately $5,000,000 for the expansion of Nesscap's current manufacturing and core R+D operations in Korea and for general corporate purposes.

Posted: Oct 6th, 2011

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