This book describes some of the latest advances in microscopic technologies in fields as diverse as biochemistry, materials science, medicine, and electronics.
Posted: Mar 12th, 2014
Read more
Changing the texture and surface characteristics of a semiconductor material at the nanoscale can influence the way that neural cells grow on the material.
Posted: Mar 12th, 2014
Read more
Researchers have discovered that creating a graphene-copper-graphene 'sandwich' strongly enhances the heat conducting properties of copper, a discovery that could further help in the downscaling of electronics.
Posted: Mar 12th, 2014
Read more
Researchers found that, against expectations, the Third Law of Thermodynamics could be restored in thin films of the magnetic material spin ice.
Posted: Mar 12th, 2014
Read more
Faster, smaller and more energy efficient ? that is what tomorrow's computers should look like. This means that data needs to be written and processed faster. Physicists are now a great deal closer to that goal.
Posted: Mar 12th, 2014
Read more
In an effort to better understand the challenges stalling the electric car, an international research team has been investigating batteries and battery materials and have revealed a new underlying mechanical interaction that occurs during the carbon coating process.
Posted: Mar 11th, 2014
Read more
Just when you thought your origami skills couldn't be beat - try using the world's thinnest material, making the origami fold and unfold itself, and packing more inside than anyone expected.
Posted: Mar 11th, 2014
Read more
Biomedical engineering researchers have developed a new technique that uses adenosine-5'-triphosphate (ATP), the so-called 'energy molecule', to trigger the release of anti-cancer drugs directly into cancer cells.
Posted: Mar 11th, 2014
Read more
CEA-Leti announced today it has fabricated ultra-scaled split-gate memories with gate length of 16nm, and demonstrated their functionality, showing good writing and erasing performances with memory windows over 6V.
Posted: Mar 11th, 2014
Read more
3D IC stacking is the most promising way to extend the limit of the miniaturization of large-scale-integration of 2D circuits on Si chips. A new paper discussed some major metallurgical challenges in microelectronic 3D IC packaging technology. It provides a deep insight of the further efforts needed in developing this technology.
Posted: Mar 11th, 2014
Read more
A tiny silicon chip designed by Caltech researchers eliminates the need for bulky and expensive lenses, and instead projects the image electronically by 'bending the light' with no mechanically moving parts.
Posted: Mar 11th, 2014
Read more
This document presents a detailed report of the discussion and recommendations derived from the discussions at the OECD Expert Meeting on Ecotoxicology and Environmental Fate.
Posted: Mar 11th, 2014
Read more
Scientists at Oak Ridge National Laboratory recently discovered an unanticipated factor in the performance of polymer-based solar devices that gives new insight on how these materials form and function.
Posted: Mar 11th, 2014
Read more
Insurers have labelled growing multi-billion dollar nanotechnology industry as an emerging risk as little is known about the long-term effects.
Posted: Mar 11th, 2014
Read more
Biophysiker der Universität Bielefeld haben einen entscheidenden Beitrag zu einer internationalen Studie zur Erbkrankheit ARVC geleistet.
Posted: Mar 11th, 2014
Read more
This breakthrough achievement is an important step to bring organic photovoltaic cells to a higher level in the competitive thin-film photovoltaics marketplace.
Posted: Mar 11th, 2014
Read more