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Metallurgical challenges in microelectronic 3D IC packaging technology

3D IC stacking is the most promising way to extend the limit of the miniaturization of large-scale-integration of 2D circuits on Si chips. A new paper discussed some major metallurgical challenges in microelectronic 3D IC packaging technology. It provides a deep insight of the further efforts needed in developing this technology.

Mar 11th, 2014

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Bending the light with a tiny chip

A tiny silicon chip designed by Caltech researchers eliminates the need for bulky and expensive lenses, and instead projects the image electronically by 'bending the light' with no mechanically moving parts.

Mar 11th, 2014

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Diagnosing diseases with smartphones

Researchers are developing a disease diagnostic system that offers results that could be read using only a smart phone and a $20 lens attachment. This new device relies on specific chemical interactions that form between something that causes a disease - a virus or bacteria, for example - and a molecule that bonds with that one thing only, like a disease-fighting antibody.

Mar 10th, 2014

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Biomolecular tweezers facilitate study of mechanical force effects on cells and proteins

A new type of biomolecular tweezers could help researchers study how mechanical forces affect the biochemical activity of cells and proteins. The devices - too small to see without a microscope - use opposing magnetic and electrophoretic forces to precisely stretch the cells and molecules, holding them in position so that the activity of receptors and other biochemical activity can be studied.

Mar 10th, 2014

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Mapping the behavior of charges in correlated spin-orbit coupled materials

A team of physicists has mapped the inner atomic workings of a compound within the mysterious class of materials known as spin-orbit Mott insulators. The findings confirm the properties that theorists predict could lead to discoveries in superconductivity, the topological phases of matter and new forms of magnetism.

Mar 10th, 2014

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