Atomic layer deposition Conferences and Events

Atomic layer deposition is a vapor-phase thin-film technique that builds materials one atomic or molecular layer at a time through sequential, self-limiting surface reactions. Known as atomic layer deposition, or ALD, the method enables highly uniform, conformal coatings on flat, porous, high-aspect-ratio, and three-dimensional structures. Its defining strengths are precise thickness control, excellent step coverage, and the ability to coat complex nanoscale surfaces.

ALD matters because many devices require ultrathin, pinhole-free, and compositionally controlled films. It is used or studied for microelectronics, batteries, catalysts, solar cells, sensors, membranes, biomedical devices, protective coatings, and quantum materials. ALD can deposit oxides, nitrides, sulfides, metals, fluorides, and hybrid films, while area-selective and spatial ALD approaches support advanced manufacturing. The technique connects strongly to thin films, surface engineering, and nanofabrication.

Conferences on atomic layer deposition appear in dedicated ALD meetings and broader programs on semiconductors, energy materials, nanotechnology, coatings, and surface science. Sessions often address precursors, reaction mechanisms, plasma-enhanced ALD, selective deposition, high-k dielectrics, and scale-up. Tracking ALD events helps researchers follow one of the most precise tools for nanoscale film and interface engineering.

To learn more, read our detailed glossary article on atomic layer deposition.