SABIC and Lockheed Martin have announced the launching of a partnership to explore the establishment of a new joint venture company in Saudi Arabia to develop carbon nanostructure materials for a variety of end markets and applications.
IBM researchers announced they have demonstrated a new record of 85.9 billion bits of data per square inch in areal data density on low-cost linear magnetic particulate tape - a significant update to one of the computer industry's most resilient, reliable and affordable data storage technologies for Big Data.
Optomec announced today that the company will feature Aerosol Jet printers for 3D Printed Electronics applications at the LOPEC International Conference and Exhibition. The conference will be held May 26-28 at the Messe Munchen in Germany.
FlexTech Alliance, an industry consortium for flexible, printed electronics, today announced the completion of its project with Imprint Energy of Alameda, Calif., for the print manufacturing of ultrathin, flexible, and rechargeable batteries. The project is one of a series of demonstrators currently being funded by FlexTech under its agreement with the U.S. Army Research Laboratory.
NEI Corporation is developing a lithium-ion battery where the electrolytes are dissolved in water instead of an organic solvent. The aqueous-based lithium-ion battery has the potential to eliminate the risks associated with state of the art lithium-ion batteries, where the organic solvents are highly flammable.
Pixelligent announced today it has entered into a Cooperative Research and Development Agreement (CRADA) with Oak Ridge National Laboratory. Entering into this CRADA allows Pixelligent to further optimize materials and formulations to demonstrate improved performance and cost for roll-to-roll manufacturing, including for OLED devices.
XEI Scientific Inc, manufacturer of the popular EVACTRON De-Contaminator Plasma Cleaning System for electron microscopes and other vacuum chambers, was awarded a US patent on May 6, 2014, for a device to load TEM sample holders into a vacuum chamber.
Cadence Design Systems, Inc. announced the immediate availability of two intellectual property solutions for third-party designs on the 28nm FD-SOI process node that is accessible via the recently announced agreement between STMicroelectronics and Samsung Electronics.