FlexTech Alliance, an industry consortium for flexible, printed electronics, today announced the completion of its project with Imprint Energy of Alameda, Calif., for the print manufacturing of ultrathin, flexible, and rechargeable batteries. The project is one of a series of demonstrators currently being funded by FlexTech under its agreement with the U.S. Army Research Laboratory.
NEI Corporation is developing a lithium-ion battery where the electrolytes are dissolved in water instead of an organic solvent. The aqueous-based lithium-ion battery has the potential to eliminate the risks associated with state of the art lithium-ion batteries, where the organic solvents are highly flammable.
Pixelligent announced today it has entered into a Cooperative Research and Development Agreement (CRADA) with Oak Ridge National Laboratory. Entering into this CRADA allows Pixelligent to further optimize materials and formulations to demonstrate improved performance and cost for roll-to-roll manufacturing, including for OLED devices.
XEI Scientific Inc, manufacturer of the popular EVACTRON De-Contaminator Plasma Cleaning System for electron microscopes and other vacuum chambers, was awarded a US patent on May 6, 2014, for a device to load TEM sample holders into a vacuum chamber.
Cadence Design Systems, Inc. announced the immediate availability of two intellectual property solutions for third-party designs on the 28nm FD-SOI process node that is accessible via the recently announced agreement between STMicroelectronics and Samsung Electronics.
The Hiden IMP-EPD end point detector system directly monitors the surface ions generated in the etching process, identifying the species present, their relative abundances and precisely defining the interlayer boundary to just 2.5 Angstrom. Species with molecular weights up to 300amu are determined.
The NPXY60-258 and the NPXY60Z20-257 piezo stages are the latest additions to nPoint's nanopositioning lineup. These stages are designed for advanced research markets in need of UHV and non-magnetic positioning.
Agilent Technologies Inc. introduced its AFM-enabled Scanning Electrochemical Microscopy (SECM) mode, a seamlessly integrated technology package that enables scientists to perform scanning electrochemical microscopy on conductive and insulating samples. The system uses an Agilent atomic force microscope.
Toshiba Corporation today announced that it will demolish the No. 2 semiconductor fabrication facility (Fab 2) at Yokkaichi Operations, the company's NAND Flash memory plant in Mie prefecture, Japan, and replace it with a new fab on the same site.