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Cadence Strengthens TSMC's 65nm Integrated Signoff Flow

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that it increases tool support in TSMC's 65-nanometer Integrated Signoff Flow by introducing RTL Compiler, EDI System, QRC Extraction and Encounter Timing System for Signal Integrity into it.

Posted: Apr 12th, 2010

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Cambrios Technologies Selects Ascent Solar as PV Partner for DoD Flexible Solar Cell Contract

Ascent Solar Technologies, Inc., a developer of state of the art flexible thin-film solar modules, announced today that Cambrios Technologies Corporation, a firm that has developed innovative, wet-processed, transparent conductive films, has selected Ascent as their research partner to investigate how these films can be applied to lightweight, flexible copper-indium-gallium-selenium (CIGS) photovoltaics.

Posted: Apr 12th, 2010

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SPTS Begins 2010 With Solid Q1 Shipments of $40M

SPTS was formed in October 2009 to merge Surface Technology Systems plc (STS) and assets acquired from Aviza Technology, Inc., including the single wafer process equipment subsidiary Aviza Technology Ltd. (ATL) and the Scotts Valley based thermal products business.

Posted: Apr 12th, 2010

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Presenting In-line Particle Sizing for High Shear Granulation

At the Advances in Process Analytics and Control Technology 2010 Conference (APACT 10; 28-30 April 2010, Manchester, UK), Malvern Instruments process systems specialist Jarvis Jeejing will give a presentation of in-line particle size analysis for high shear granulation processes.

Posted: Apr 9th, 2010

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