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Multiple Interoperable EDA Technology Files From TSMC Now Available for 65nm, 40nm and 28nm Chip Designs

Taiwan Semiconductor Manufacturing Company has made available several unified and interoperable electronic design automation (EDA) technology files for its 65 nanometer (nm), 40nm and 28nm process nodes. The design technology file suite includes interoperable process design kit (iPDK), interoperable design rule check (iDRC), layout-versus-schematic (iLVS), and interoperable interconnect extraction (iRCX).

Posted: Apr 6th, 2010

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Y-Carbon recognized as a 2010 Success Story

Y-Carbon, Inc. is pleased to announce that they have been recognized as a 2010 success story by the Department of Community and Economic Development (DCED) of the Commonwealth of Pennsylvania.

Posted: Apr 5th, 2010

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Creative Collaboration Can Strengthen Chip Industry

Facing financial constraints and serious technical challenges, the semiconductor industry must practice creative collaboration to survive, grow, and link to emerging industries, SEMATECH President and CEO Dan Armbrust said in a recent keynote address to SEMATECH's 2010 Surface Preparation and Cleaning Conference in Austin, TX.

Posted: Apr 3rd, 2010

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DEK to Showcase Advanced Solar Technologies at Photon Expo 2010

The DEK Solar team is preparing to take a selection of new and proven solar technologies to this year's Photon exhibition, being held in Stuttgart from 27th - 29th April. Stand D32 will showcase technologies including the award-winning PVP1200 metallization platform, solar dryer and brand new hybrid stencil technologies.

Posted: Apr 1st, 2010

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Bruker Announces Formation of New Chemical Analysis Division

Bruker Corporation announced today that it has created a Chemical Analysis Division within its Bruker Daltonics subsidiary. The new Chemical Analysis Division will be managed by Collin D'Silva as division president, and will be headquartered in Fremont, California.

Posted: Apr 1st, 2010

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