CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.
On February 8, 2011 the President of the Russian Federation Dmitry Medvedev attended the exhibition "The history of Russian innovations: from periodic table to graphene" that was held in the Polytechnical Museum and opened the 1st Russian Festival of Science. SOLVER NEXT was presented and aroused significant interest of the President.
RUSNANO and The Dow Chemical Company through its wholly owned subsidiary Dow Europe GmbH have signed a memorandum of understanding to evaluate potential cooperation in fast-growing areas such as energy efficiency, infrastructure, light-weight materials, and life sciences.
Nitto Denko Asia Technical Centre (NAT) will be expanding its Singapore base to include a prototyping centre in Singapore. The centre will be pioneered at A*STAR's Institute of Materials Research and Engineering (IMRE) under a unique Lab-in-RI programme.
Amtech Systems, Inc., a global supplier of production and automation systems and related supplies for the manufacture of solar cells, today announced it has completed its previously announced acquisition of 55% ownership of Kingstone Technology Hong Kong Limited, a Hong Kong-based holding company that owns 100% of Kingstone Semiconductor Company Ltd, a Shanghai-based technology company specializing in ion implant solutions for the solar and semiconductor industries.
AIXTRON SE today announced a new MOCVD reactor order from existing customer Ubilux of Tainan County, Taiwan. The order is for two AIXTRON CRIUS II deposition systems in the 55x2-inch configuration which will be used to expand the company's production capacity for GaN-based HB LEDs.
GaN based epitaxy on silicon (Si) is very challenging because of the thermal mismatch between GaN and Si, which causes extreme tensile stress after cooling. For such applications LayTec's EpiCurveTT is the tool of choice for a precise in-situ strain engineering.
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 1 gigabit (Gb) mobile DRAM with a wide I/O interface, using 50 nanometer class process technology. The new wide I/O mobile DRAM will be used in mobile applications, such as smartphones and tablet PCs.
MEMSCAP, the leading provider of innovative solutions based on MEMS (micro-electro-mechanical systems) technology, including optical components, today announces it has successfully completed die level reliability testing beyond 200 millions cycles on its Thermally Actuated Variable Optical Attenuators.
WATT Fuel Cell Corp., a designer and developer of solid oxide fuel cell (SOFC) systems, announces an agreement granting the company an exclusive worldwide license to fuel cell technology intellectual property previously developed and implemented at NanoDynamics Energy Inc.
rIQ is designed to determine the refractive index of glass quickly, accurately and easily. A vital instrument for any forensic laboratory, rIQ is offered in a standalone configuration, as part of a microspectrophotometer which includes color analysis of glass, or as an upgrade package.
Picosun Oy, Finland-based global manufacturer of state-of-the-art Atomic Layer Deposition (ALD) systems, joined forces with other high profile Finnish high-tech companies to boost India's emerging clean technology markets with world-leading know-how on issues such as wind power, water management and nanotechnology solutions for green and sustainable development at the Delhi Sustainable Development Summit (DSDS) February 3rd - 5th, Delhi, India 2011.