The laser debonder can be used as a stand-alone, semi-automated system or as an integrated process module in SUSS MicroTec's XBC300 Gen2 platform. The debonding method used in the ELD300 relies on a 308nm Excimer laser to separate the glass carrier from a tape mounted thin wafer.
Demonstrating its expertise in precision materials engineering, Applied Materials, Inc. today announced two new systems that help customers solve critical challenges in manufacturing high-performance, power-efficient 3D devices.
Vorbeck Materials Corp., a world leader in the field of graphene, has entered into a strategic investment and technology development agreement with In-Q-Tel, Inc., the independent strategic investment firm that identifies innovative technology solutions to support the missions of the U.S. Intelligence Community.
Applied Materials, Inc. today announced the Applied Varian VIISta 900 3D system, the industry's state-of-the-art medium-current ion implantation tool developed for manufacturing FinFET and 3D NAND designs at sub-2x nanometer nodes.