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EV Group Unveils New Via-Filling Process to Improve Reliability of 3D-IC / TSV Packaging

Available on the EVG100 series of resist processing systems, the new NanoFill process provides void-free via filling of very deep trenches and high-aspect ratio structures, and is suitable for all common polymeric dielectrics - offering a highly flexible, low-cost and production-ready via-fill platform for interposer development for 3D-integrated image sensors and other device types.

Posted: Sep 4th, 2013

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Beneq and Mordovia State University Open Joint ALD laboratory

On September 4, Mordovia State University will officially open a laboratory to research and study thin-film technologies (100 nm and less) using atomic layer deposition with Beneq's TFS 200 equipment. The laboratory opening is a natural next step in implementing the strategy to establish national nanotechnology in Russia.

Posted: Sep 4th, 2013

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