Angstron Materials Inc., took delivery of specialized HVAC and dehumidification equipment early this year to complete new dry rooms in building space adjacent to its manufacturing facility. The dry rooms provide a controlled environment for accelerated development and production of Angstron's nano graphene anode material for high performance batteries.
CTI has advised that further testing of the graphene paper will include measuring the thermal transport properties which will allow them to optimize the graphene/bucky paper for heat sinks and heat dissipating applications.
Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer, reports excellent process results for copper diffusion barrier deposition. ALD materials for copper diffusion barriers were investigated in the project ESiP (Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test), running from May 2010 to June 2013.
DryWired's surface modification technologies receive positive results from third party facility Quanta Laboratories after a rigorous weeklong examination of DryWired nano-coating's resistance to humidity, salt, water, dust and contaminants.
BioNano and collaborator Pui-Yan Kwok, M.D., Ph.D., Henry Bachrach Distinguished Professor at the University of California, San Francisco (UCSF), will present the first demonstration of a de novo map of the human genome using the Irys System and the utility of this map in the analysis of structural variation and genome finishing.
NEA's patented Nanotechnology will be used in effort to create new hand-held analyzer system to detect a range of Volatile Organic Compounds (VOCs), including toxic and deadly materials in food and plants.
The Fraunhofer Institute for Solar Energy Systems ISE today announced that it has joined forces with EV Group to develop equipment and process technology to enable electrically conductive and optically transparent direct wafer bonds at room temperature.
Berkeley Design Automation, Inc., today announced that TSMC is using Analog FastSPICE Mega for memory IP verification. Memory IP circuits implemented in 16-nm and smaller FinFET-based process nodes must meet stringent performance targets while requiring six-sigma bit cell yield to meet cost and power targets.
QuantumWise and the Technical University of Denmark (DTU) will engage in a project over the next 3 years to extend the capabilities of ATK. The goal is to simulate large-scale nano-electronic devices, where electron-phonon coupling is taken into account.