PositiveID Corporation , in conjunction with its development partner RECEPTORS LLC, announced today that the companies have achieved a milestone in the development of their in vivo glucose-sensing RFID microchip to detect glucose levels in the body.
FEI Company, a leading diversified scientific instruments company providing electron and ion-beam microscopes and tools for nanoscale applications across many industries, today introduced the new Helios NanoLab x50 DualBeam Series, the most powerful and versatile DualBeam system available on the market today.
At the end of March this year in Singapore, Beneq, global supplier of coating equipment for atomic layer deposition (ALD) and aerosol coating, staged a joint seminar between ALD experts from Beneq, academia and a number of industry players.
Siemens has optimized the receiver tubes for solar thermal facilities. The latest model, the UVAC 2010, is currently the most efficient solution on the market and improves the efficiency of a 50-megawatt (MW) facility by five percent.
Her Majesty the Queen has awarded a Queen's Award for Enterprise in the Innovation category to DuPont for the continuous development of DuPont Solamet photovoltaic metallization paste, a key component in increasing the energy efficiency of solar cells.
In the drive for more cost-effective solar energy, DuPont and Oerlikon Solar have collaborated on a new, ultra-thin white reflective solar photovoltaic encapsulant sheet that is part of the DuPont PV5200 Series.
Intezyne has announced it has received notification the European Patent Office intends to grant a patent covering a key element of Intezyne's breakthrough drug delivery technology, the IVECT Method. At the core of this technology is the IVECT micelle, a proprietary, polymeric nanoparticle designed to encapsulate and deliver best-in-class therapeutics, while limiting exposure to healthy tissues.
Novellus Systems has announced that it has developed precision anti-reflective layer (ARL) patterning films on its VECTOR PECVD platform with less than 2 angstroms wafer-to-wafer thickness variability.
Axcess International Inc., a leader in wireless credentials, today announced it has secured a contract for providing a wireless ID system in support of advanced workforce management applications that will improve the safety of workers on a large oil platform in the Far East.
BASF has created an advanced copper plating chemistry for current and future generation chip technologies. The innovative chemical solution, which is the direct result of the joint development program with IBM started in June 2007, outperforms other commercially available chemistries.