The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.
Applied Materials, Inc. today announced a suite of new defect review and classification technologies for its market-leading SEMVision family of products to accelerate time to yield for leading-edge chip manufacturing at 1X-nm and beyond.
New NMOS epitaxy deposition process is essential for faster transistors inside next-generation mobile processor chips. NMOS epitaxy boosts transistor speed by the equivalent of half a device node without increasing off-state power consumption.
LayTec announced its cooperation with Meyer Burger, a global technology group specializing in systems, product equipment and services along the photovoltaic value chain including the manufacturing processes for wafers, solar cells, solar modules and solar systems. Combined efforts of both companies resulted in the world's first fully integrated EVA cross-linking metrology solution for PV module production lines.
The President of the Russian Union of Chemists Viktor Ivanov and Chief Executive Officer of the Fund for Infrastructure and Educational Programs Andrew Swinarenko signed an agreement on the promotion of the production and implementation of nanotechnology at chemical enterprises.
Nanosphere, Inc., a leader in the development and commercialization of advanced molecular diagnostics systems, announced publication of a prospective, multicenter study that illustrates the high diagnostic accuracy and potential clinical impact of the company's FDA-cleared Verigene Gram-Positive Blood Culture Test in the peer-reviewed, open-access journal PLOS Medicine.
The NX-HDM system sets a new standard for the industry in automatic defect review AFM technology by increasing throughput up to 1000 percent and an offering of 30% higher success rate than prior system, analyzing, identifying and scanning media for all wafer sizes up to 150mm.