Applied Materials, Inc. today announced the Applied Varian VIISta 900 3D system, the industry's state-of-the-art medium-current ion implantation tool developed for manufacturing FinFET and 3D NAND designs at sub-2x nanometer nodes.
Swedish pharmaceutical company Oasmia Pharmaceutical AB announced that a research agreement has been signed between Oasmia and a global pharmaceutical company. The agreement relates to the use of Oasmia's patented nanoparticle formulation technology XR-17.
The proceeds will be used for completing the development of Nanography, Landa's water-based digital printing process, including engineering and production ramp-up of Landa Nanographic Printing Presses and building of manufacturing plants for Landa NanoInk colorants.
Endomagnetics, the company developing a portfolio of products to improve the standard of cancer care, announced today the acquisition of the ACT portfolio and related assets from Actium Biosystems, LLC. This move extends Endomagnetics' oncology platform from diagnostics into therapeutics while maintaining synergies with its magnetic nanoparticle technology.
Under the terms of the Agreement, PeptiMed will provide the NCL with nanocomplex consisting of its proprietary siRNA and patented elastin-like polypeptides, and NCL personnel will measure material properties indicative of safety and efficacy for potential future dosing in the clinic.
The PEBASlide product line is a direct result of a technology license recently signed with CCAN - the Collaborative Centre for Applied Nanotechnology. The licensed technology allows IPC to enhance the properties of PEBAX, a widely used polymer in the medical device industry.
BIND Therapeutics, Inc., a clinical-stage nanomedicine platform company developing targeted and programmable therapeutics called Accurins, today announced that it has entered into a research agreement with Roche to discover novel nanomedicines using Accurins for the treatment of diseases in therapeutic areas outside of oncology.
Agilent Technologies Inc. announced several innovations for the 2014 release of its industry-leading suite of device modeling and characterization software tools. The suite comprises Agilent EEsof EDA's Integrated Circuits Characterization and Analysis Program (IC-CAP), Model Builder Program (MBP), and Model Quality Assurance (MQA).