Scientists have developed a generalized strategy for the synthesis of mesoporous colloidal superparticles made of nanocrystals of platinum-group metals through self-limited growth of metal nanocrystals (or precursors) and silver halide in individual colloidal particles.
Rersearchers have created unexpected shapes of mesoscale atoms - structures built of microdroplets encapsulated within microdroplets. The discovery was possible with a new method for precise control over placement of tiny segments of liquid, one in another. With further progress in innovative microfluidic systems, the method may find use in medicine and materials science.
Most people are naturally adept at reading facial expressions - from smiling and frowning to brow-furrowing and eye-rolling - to tell what others are feeling. Now scientists have developed ultra-sensitive, wearable sensors that can do the same thing.
Conventional electroluminescent foils can be bent up to a certain degree only and can be applied easily onto flat surfaces. A new process now allows for the direct printing of electroluminescent layers onto three-dimensional components.
Little is known about how the proteins forming ion channels - the 'pores' on the cell membrane - change when they open and close, especially the portion that is 'embedded' in the membrane. Scientists have invented a method, based on the combined and innovative use of known techniques, which allowed them to observe in detail a specific membrane protein and its structural changes.
Researchers have found a way to couple the properties of different two-dimensional materials to provide an exceptional degree of control over light waves. They say this has the potential to lead to new kinds of light detection, thermal-management systems, and high-resolution imaging devices.
Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects. The new scheme has great potential to overcome resistivity and reliability issues that occur while scaling conventional Cu damascene interconnects for advanced nodes.
The US Environmental Protection Agency (EPA) proposed a new rule detailing one-time reporting and record-keeping requirements for manufacturers and processors of nanoscale materials under Section 8(a) of the Toxic Substances Control Act (TSCA).