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Posted: Oct 05, 2010
Advancements in Thermal Management 2010 showcases the future of thermal mitigation technologies
(Nanowerk News) Advancements in Thermal Management 2010 is a technical symposium for design engineers and product developers looking to push the capabilities of their electronics designs. Being held on Oct. 19th, 2010 at the Gaylord Texan in Dallas, Texas, this event will feature presentations on the latest advancements in thermal management and thermal technology for electronics packaging and cooling, temperature sensing and control, thermal materials, systems design and management for optimizing thermal properties.
"Designing electronics with high power needs and processing power is taxing the limits of thermal management and protection technology," said Nick Depperschmidt, program chairman. "Because of this, engineers must stay up-to-date on the latest advancements in this rapidly changing field. Attendance at Advancements in Thermal Management 2010 will provide that kind of educational experience."
According to a study from BCC Research, the value of the global market for thermal management technologies is an estimated $7.5 billion in 2010, but is expected to increase to $10.2 billion in 2015, for a five-year compound annual growth rate (CAGR) of 6.4 percent. In recent years, there has been tremendous progress, technologically and in terms of demand, in electronic devices and systems. According to BCC, the technological progress has come on two main fronts, increased functionality on a single device unit and miniaturization of each unit. Both of these developments have increased the need for thermal management technology.
Presentations from Industry-Leading Companies Include:
Upcoming and Emerging Technologies for Thermal Management • Nathan Muoio, Mechanical Engineer, Purcell Systems
Thermal Management by Alumina – A 'New' Old Material • Dr. Wolfgang Tschanun, Head Micro Systems Technologies activities, Reinhardt Microtech
Advancements in Air Moving Technology for Active Cooling of Electronics in Lighting, Telecom, Embedded, Computing and Medical Applications • Brandon Noska, Applications Engineering Manager, Nuventix
Advancements in Thermal Management at PCB Board Level for Electronics Design and Fabrication • Pratish Patel, President and CEO, Electronic Interconnect
Advanced Nano-particle Coolant for Electronics and Battery Cooling • D. Patrick McMullen, Business Development Manager, Dynalene, Inc.
Thermal Efficiency Study of Heat Shield Materials • Venugopal Vengala, Design Engineer, Cummins, Inc.
Advancements in Thermal Management 2010 will be co-located with Antenna Systems 2010, Remote 2010 Conference and Expo, Energy Efficiency Expo, Battery Power 2010 and EMCW Expo.