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Large-scale fabrication of integrated nanoelectronic devices moves closer

A new methodology for integrating nanowires with micropatterned substrates using directed assembly and nanoscale soldering was developed by researchers at Johns Hopkins University in Baltimore. This overcomes the difficulty in making electrical contacts to nanoparticles, which so far has been a major limitation to fabricating integrated nanoelectronic devices containing large numbers of nanoparticles.

Mar 14th, 2006